Inventor
VERHAVERBEKE STEVEN
US137 patents
⚠️ This page may combine multiple inventors who share the name “VERHAVERBEKE STEVEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
APPLIED MATERIALS INC
38 patentsUS7159599B2Jan 9, 2007
Method and apparatus for processing a wafer
APPLIED MATERIALS INC96 citations97
US6927176B2Aug 9, 2005
Cleaning method and solution for cleaning a wafer in a single wafer process
APPLIED MATERIALS INC67 citations97
US7000621B1Feb 21, 2006
Methods and apparatuses for drying wafer
APPLIED MATERIALS INC57 citations96
US6843855B2Jan 18, 2005
Methods for drying wafer
APPLIED MATERIALS INC44 citations96
US11018032B2May 25, 2021
High pressure and high temperature anneal chamber
APPLIED MATERIALS INC15 citations94
US10636677B2Apr 28, 2020
High pressure and high temperature anneal chamber
APPLIED MATERIALS INC17 citations94
US10276411B2Apr 30, 2019
High pressure and high temperature anneal chamber
APPLIED MATERIALS INC25 citations94
US10229827B2Mar 12, 2019
Method of redistribution layer formation for advanced packaging applications
APPLIED MATERIALS INC33 citations94
US10096516B1Oct 9, 2018
Method of forming a barrier layer for through via applications
APPLIED MATERIALS INC25 citations94
US11264331B2Mar 1, 2022
Package structure and fabrication methods
APPLIED MATERIALS INC10 citations93
US10886232B2Jan 5, 2021
Package structure and fabrication methods
APPLIED MATERIALS INC16 citations93
US10211072B2Feb 19, 2019
Method of reconstituted substrate formation for advanced packaging applications
APPLIED MATERIALS INC37 citations93
US7235479B2Jun 26, 2007
Organic solvents having ozone dissolved therein for semiconductor processing utilizing sacrificial materials
APPLIED MATERIALS INC23 citations93
US7585686B2Sep 8, 2009
Method and apparatus for processing a wafer
APPLIED MATERIALS INC33 citations92
US7456113B2Nov 25, 2008
Cleaning method and solution for cleaning a wafer in a single wafer process
APPLIED MATERIALS INC23 citations92
US7037842B2May 2, 2006
Method and apparatus for dissolving a gas into a liquid for single wet wafer processing
APPLIED MATERIALS INC43 citations92
US7021319B2Apr 4, 2006
Assisted rinsing in a single wafer cleaning process
APPLIED MATERIALS INC23 citations92
US7334588B2Feb 26, 2008
Method and apparatus for wafer cleaning
APPLIED MATERIALS INC26 citations91
US11462417B2Oct 4, 2022
High pressure and high temperature anneal chamber
APPLIED MATERIALS INC6 citations86
US10234630B2Mar 19, 2019
Method for creating a high refractive index wave guide
APPLIED MATERIALS INC15 citations86
US11676832B2Jun 13, 2023
Laser ablation system for package fabrication
APPLIED MATERIALS INC7 citations85
US10347511B2Jul 9, 2019
Stiction-free drying process with contaminant removal for high-aspect ratio semiconductor device STR
APPLIED MATERIALS INC5 citations84
US7449127B2Nov 11, 2008
Cleaning method and solution for cleaning a wafer in a single wafer process
APPLIED MATERIALS INC10 citations84
US6524940B2Feb 25, 2003
Methods and devices utilizing the ammonium termination of silicon dioxide films
APPLIED MATERIALS INC17 citations84
US7163018B2Jan 16, 2007
Single wafer cleaning method to reduce particle defects on a wafer surface
APPLIED MATERIALS INC12 citations83
US6807972B2Oct 26, 2004
Gutter and splash-guard for protecting a wafer during transfer from a single wafer cleaning chamber
APPLIED MATERIALS INC13 citations83
US7718009B2May 18, 2010
Cleaning submicron structures on a semiconductor wafer surface
APPLIED MATERIALS INC18 citations82
US7451774B2Nov 18, 2008
Method and apparatus for wafer cleaning
APPLIED MATERIALS INC11 citations82
US7469883B2Dec 30, 2008
Cleaning method and solution for cleaning a wafer in a single wafer process
APPLIED MATERIALS INC9 citations80
US7435686B2Oct 14, 2008
Semiconductor processing using energized hydrogen gas and in combination with wet cleaning
APPLIED MATERIALS INC8 citations74
US7432177B2Oct 7, 2008
Post-ion implant cleaning for silicon on insulator substrate preparation
APPLIED MATERIALS INC7 citations74
US7402213B2Jul 22, 2008
Stripping and removal of organic-containing materials from electronic device substrate surfaces
APPLIED MATERIALS INC8 citations74
US7011715B2Mar 14, 2006
Rotational thermophoretic drying
APPLIED MATERIALS INC7 citations74
US6954021B2Oct 11, 2005
Matching circuit for megasonic transducer device
APPLIED MATERIALS INC8 citations74
US11281094B2Mar 22, 2022
Method for via formation by micro-imprinting
APPLIED MATERIALS INC2 citations73
US11257790B2Feb 22, 2022
High connectivity device stacking
APPLIED MATERIALS INC3 citations73
US11232951B1Jan 25, 2022
Method and apparatus for laser drilling blind vias
APPLIED MATERIALS INC2 citations73
US11063169B2Jul 13, 2021
Substrate structuring methods
APPLIED MATERIALS INC2 citations73
CFMT INC
7 patentsUS6165912ADec 26, 2000
Electroless metal deposition of electronic components in an enclosable vessel
CFMT INC309 citations99
US5972123AOct 26, 1999
Methods for treating semiconductor wafers
CFMT INC90 citations98
US6032682AMar 7, 2000
Method for sulfuric acid resist stripping
CFMT INC43 citations93
US6261845B1Jul 17, 2001
Methods and systems for determining chemical concentrations and controlling the processing of semiconductor substrates
CFMT INC40 citations92
US6132522AOct 17, 2000
Wet processing methods for the manufacture of electronic components using sequential chemical processing
CFMT INC58 citations92
US6517636B1Feb 11, 2003
Method for reducing particle contamination during the wet processing of semiconductor substrates
CFMT INC8 citations74
US6245158B1Jun 12, 2001
Wet processing methods for the manufacture of electronic components using liquids of varying temperature
CFMT INC9 citations74
IMEC VZW
1 patentMATTSON TECHNOLOGY IP
1 patentSATO TATSUYA E
1 patentNALAMASU OMKARAM
1 patentVERHAVERBEKE STEVEN
1 patentShowing the top 50 of 137 patents by PatentIndex Score.