Inventor

PARK GIBACK

US30 patents

⚠️ This page may combine multiple inventors who share the name “PARK GIBACK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

PARK GIBACK

APPLIED MATERIALS INC

Package structure and fabrication methods

Package structure and fabrication methods

Laser ablation system for package fabrication

Method for via formation by micro-imprinting

High connectivity device stacking

Substrate structuring methods

Package structure with embedded core

Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration

Package structures with built-in EMI shielding

Energy storage device having an interlayer between electrode and electrolyte layer

Laser ablation system for package fabrication

High connectivity device stacking

Package core assembly and fabrication methods

Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration

Package core assembly and fabrication methods

Package structure and fabrication methods

Package core assembly and fabrication methods

Package core assembly and fabrication methods

Substrate structuring methods

High connectivity device stacking

Package structure and fabrication methods

Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration

Laser ablation for package fabrication

Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration

Methods for improved polymer-copper adhesion

Substrate structuring methods

Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration

Methods of micro-via formation for advanced packaging

Planarization methods for packaging substrates

NAM SANGCHEOL

Multi layer for encapsulation comprising a planarizing organic thin layer and a conformal organic thin layer