Inventor
Cho Kyuil
US32 patents
Patents
32 patentsUS11264331B2Mar 1, 2022
Package structure and fabrication methods
APPLIED MATERIALS INC10 citations93
US10886232B2Jan 5, 2021
Package structure and fabrication methods
APPLIED MATERIALS INC16 citations93
US10211072B2Feb 19, 2019
Method of reconstituted substrate formation for advanced packaging applications
APPLIED MATERIALS INC37 citations93
US11367643B2Jun 21, 2022
Method for substrate registration and anchoring in inkjet printing
APPLIED MATERIALS INC1 citations73
US11322381B2May 3, 2022
Method for substrate registration and anchoring in inkjet printing
APPLIED MATERIALS INC1 citations73
US11281094B2Mar 22, 2022
Method for via formation by micro-imprinting
APPLIED MATERIALS INC2 citations73
US11257790B2Feb 22, 2022
High connectivity device stacking
APPLIED MATERIALS INC3 citations73
US10937726B1Mar 2, 2021
Package structure with embedded core
APPLIED MATERIALS INC3 citations73
US10727083B1Jul 28, 2020
Method for via formation in flowable epoxy materials by micro-imprint
APPLIED MATERIALS INC4 citations73
US11715700B2Aug 1, 2023
Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration
APPLIED MATERIALS INC2 citations72
US10547040B2Jan 28, 2020
Energy storage device having an interlayer between electrode and electrolyte layer
APPLIED MATERIALS INC2 citations70
US12388049B2Aug 12, 2025
High connectivity device stacking
APPLIED MATERIALS INC0 citations62
US12374611B2Jul 29, 2025
Package core assembly and fabrication methods
APPLIED MATERIALS INC0 citations62
US12354968B2Jul 8, 2025
Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration
APPLIED MATERIALS INC0 citations62
US12087679B2Sep 10, 2024
Package core assembly and fabrication methods
APPLIED MATERIALS INC0 citations62
US11925073B2Mar 5, 2024
Stretchable polymer and dielectric layers for electronic displays
APPLIED MATERIALS INC0 citations62
US11887934B2Jan 30, 2024
Package structure and fabrication methods
APPLIED MATERIALS INC0 citations62
US11881447B2Jan 23, 2024
Package core assembly and fabrication methods
APPLIED MATERIALS INC0 citations62
US11862546B2Jan 2, 2024
Package core assembly and fabrication methods
APPLIED MATERIALS INC0 citations62
US11798831B2Oct 24, 2023
Method for substrate registration and anchoring in inkjet printing
APPLIED MATERIALS INC0 citations62
US11742330B2Aug 29, 2023
High connectivity device stacking
APPLIED MATERIALS INC0 citations62
US11521935B2Dec 6, 2022
Package structure and fabrication methods
APPLIED MATERIALS INC0 citations62
US11476202B2Oct 18, 2022
Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration
APPLIED MATERIALS INC0 citations62
US11398433B2Jul 26, 2022
Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration
APPLIED MATERIALS INC0 citations62
US11388822B2Jul 12, 2022
Methods for improved polymer-copper adhesion
APPLIED MATERIALS INC1 citations62
US11329003B2May 10, 2022
Anchoring dies using 3D printing to form reconstructed wafer
APPLIED MATERIALS INC1 citations62
US11264333B2Mar 1, 2022
Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration
APPLIED MATERIALS INC0 citations62
US11258045B2Feb 22, 2022
Methods of forming stretchable encapsulation for electronic displays
APPLIED MATERIALS INC1 citations62
US11211439B2Dec 28, 2021
Stretchable polymer and dielectric layers for electronic displays
APPLIED MATERIALS INC0 citations62
US11705365B2Jul 18, 2023
Methods of micro-via formation for advanced packaging
APPLIED MATERIALS INC0 citations52
US11362307B2Jun 14, 2022
Encapsulation having polymer and dielectric layers for electronic displays
APPLIED MATERIALS INC0 citations52
US11342256B2May 24, 2022
Method of fine redistribution interconnect formation for advanced packaging applications
APPLIED MATERIALS INC0 citations52