P

Inventor

CHEN COMING

TW40 patents
⚠️ This page may combine multiple inventors who share the name “CHEN COMING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

UNITED MICROELECTRONICS CORP

37 patents
US5950090ASep 7, 1999

Method for fabricating a metal-oxide semiconductor transistor

UNITED MICROELECTRONICS CORP125 citations98
US6306722B1Oct 23, 2001

Method for fabricating shallow trench isolation structure

UNITED MICROELECTRONICS CORP53 citations96
US6169012B1Jan 2, 2001

Chemical mechanical polishing for forming a shallow trench isolation structure

UNITED MICROELECTRONICS CORP32 citations96
US5933748AAug 3, 1999

Shallow trench isolation process

UNITED MICROELECTRONICS CORP85 citations95
US6838357B2Jan 4, 2005

Chemical mechanical polishing for forming a shallow trench isolation structure

UNITED MICROELECTRONICS CORP13 citations93
US6274450B1Aug 14, 2001

Method for implementing metal oxide semiconductor field effect transistor

UNITED MICROELECTRONICS CORP20 citations93
US6200840B1Mar 13, 2001

Method for producing PMOS devices

UNITED MICROELECTRONICS CORP31 citations93
US6177336B1Jan 23, 2001

Method for fabricating a metal-oxide semiconductor device

UNITED MICROELECTRONICS CORP40 citations93
US6178543B1Jan 23, 2001

Method of designing active region pattern with shift dummy pattern

UNITED MICROELECTRONICS CORP25 citations93
US6174778B1Jan 16, 2001

Method of fabricating metal oxide semiconductor

UNITED MICROELECTRONICS CORP34 citations93
US6140227AOct 31, 2000

Method of fabricating a glue layer of contact/via

UNITED MICROELECTRONICS CORP20 citations93
US6083827AJul 4, 2000

Method for fabricating local interconnect

UNITED MICROELECTRONICS CORP22 citations93
US5958795ASep 28, 1999

Chemical-mechanical polishing for shallow trench isolation

UNITED MICROELECTRONICS CORP30 citations93
US5770508AJun 23, 1998

Method of forming lightly doped drains in metalic oxide semiconductor components

UNITED MICROELECTRONICS CORP39 citations93
US6475865B1Nov 5, 2002

Method of fabricating semiconductor device

UNITED MICROELECTRONICS CORP36 citations92
US6004852ADec 21, 1999

Manufacture of MOSFET having LDD source/drain region

UNITED MICROELECTRONICS CORP37 citations92
US6187645B1Feb 13, 2001

Method for manufacturing semiconductor device capable of preventing gate-to-drain capacitance and eliminating birds beak formation

UNITED MICROELECTRONICS CORP19 citations84
US6136713AOct 24, 2000

Method for forming a shallow trench isolation structure

UNITED MICROELECTRONICS CORP17 citations84
US6894364B2May 17, 2005

Capacitor in an interconnect system and method of manufacturing thereof

UNITED MICROELECTRONICS CORP13 citations81
US7018906B2Mar 28, 2006

Chemical mechanical polishing for forming a shallow trench isolation structure

UNITED MICROELECTRONICS CORP10 citations74
US6448159B1Sep 10, 2002

Chemical mechanical polishing for forming a shallow trench isolation structure

UNITED MICROELECTRONICS CORP6 citations74
US6316330B1Nov 13, 2001

Method of fabricating a shallow trench isolation semiconductor device

UNITED MICROELECTRONICS CORP7 citations74
US6232161B1May 15, 2001

Method for forming a dummy active pattern

UNITED MICROELECTRONICS CORP10 citations74
US6228209B1May 8, 2001

Equipment for forming a glue layer of an opening

UNITED MICROELECTRONICS CORP6 citations74
US6177332B1Jan 23, 2001

Method of manufacturing shallow trench isolation

UNITED MICROELECTRONICS CORP10 citations74
US6133083AOct 17, 2000

Method to fabricate embedded DRAM

UNITED MICROELECTRONICS CORP9 citations74
US6117743ASep 12, 2000

Method of manufacturing MOS device using anti reflective coating

UNITED MICROELECTRONICS CORP13 citations74
US6063689AMay 16, 2000

Method for forming an isolation

UNITED MICROELECTRONICS CORP11 citations74
US6015755AJan 18, 2000

Method of fabricating a trench isolation structure using a reverse mask

UNITED MICROELECTRONICS CORP15 citations74
US5976984ANov 2, 1999

Process of making unlanded vias

UNITED MICROELECTRONICS CORP10 citations74
US7001713B2Feb 21, 2006

Method of forming partial reverse active mask

UNITED MICROELECTRONICS CORP2 citations63
US6486040B2Nov 26, 2002

Chemical mechanical polishing for forming a shallow trench isolation structure

UNITED MICROELECTRONICS CORP2 citations63
US6365471B1Apr 2, 2002

Method for producing PMOS devices

UNITED MICROELECTRONICS CORP3 citations63
US6323105B1Nov 27, 2001

Method for fabricating an isolation structure including a shallow trench isolation structure and a local-oxidation isolation structure

UNITED MICROELECTRONICS CORP4 citations63
US6291111B1Sep 18, 2001

Method of trench polishing

UNITED MICROELECTRONICS CORP2 citations63
US6277699B1Aug 21, 2001

Method for forming a metal-oxide-semiconductor transistor

UNITED MICROELECTRONICS CORP6 citations63
US6810511B2Oct 26, 2004

Method of designing active region pattern with shift dummy pattern

UNITED MICROELECTRONICS CORP0 citations52

UNITED MIROELECTRONICS CORP

1 patent

UNITED MICROELECTRICS CORP

1 patent

PERSONAL GENOMICS INC

1 patent