Inventor
CHEN COMING
TW40 patents
⚠️ This page may combine multiple inventors who share the name “CHEN COMING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
UNITED MICROELECTRONICS CORP
37 patentsUS5950090ASep 7, 1999
Method for fabricating a metal-oxide semiconductor transistor
UNITED MICROELECTRONICS CORP125 citations98
US6306722B1Oct 23, 2001
Method for fabricating shallow trench isolation structure
UNITED MICROELECTRONICS CORP53 citations96
US6169012B1Jan 2, 2001
Chemical mechanical polishing for forming a shallow trench isolation structure
UNITED MICROELECTRONICS CORP32 citations96
US5933748AAug 3, 1999
Shallow trench isolation process
UNITED MICROELECTRONICS CORP85 citations95
US6838357B2Jan 4, 2005
Chemical mechanical polishing for forming a shallow trench isolation structure
UNITED MICROELECTRONICS CORP13 citations93
US6274450B1Aug 14, 2001
Method for implementing metal oxide semiconductor field effect transistor
UNITED MICROELECTRONICS CORP20 citations93
US6200840B1Mar 13, 2001
Method for producing PMOS devices
UNITED MICROELECTRONICS CORP31 citations93
US6177336B1Jan 23, 2001
Method for fabricating a metal-oxide semiconductor device
UNITED MICROELECTRONICS CORP40 citations93
US6178543B1Jan 23, 2001
Method of designing active region pattern with shift dummy pattern
UNITED MICROELECTRONICS CORP25 citations93
US6174778B1Jan 16, 2001
Method of fabricating metal oxide semiconductor
UNITED MICROELECTRONICS CORP34 citations93
US6140227AOct 31, 2000
Method of fabricating a glue layer of contact/via
UNITED MICROELECTRONICS CORP20 citations93
US6083827AJul 4, 2000
Method for fabricating local interconnect
UNITED MICROELECTRONICS CORP22 citations93
US5958795ASep 28, 1999
Chemical-mechanical polishing for shallow trench isolation
UNITED MICROELECTRONICS CORP30 citations93
US5770508AJun 23, 1998
Method of forming lightly doped drains in metalic oxide semiconductor components
UNITED MICROELECTRONICS CORP39 citations93
US6475865B1Nov 5, 2002
Method of fabricating semiconductor device
UNITED MICROELECTRONICS CORP36 citations92
US6004852ADec 21, 1999
Manufacture of MOSFET having LDD source/drain region
UNITED MICROELECTRONICS CORP37 citations92
US6187645B1Feb 13, 2001
Method for manufacturing semiconductor device capable of preventing gate-to-drain capacitance and eliminating birds beak formation
UNITED MICROELECTRONICS CORP19 citations84
US6136713AOct 24, 2000
Method for forming a shallow trench isolation structure
UNITED MICROELECTRONICS CORP17 citations84
US6894364B2May 17, 2005
Capacitor in an interconnect system and method of manufacturing thereof
UNITED MICROELECTRONICS CORP13 citations81
US7018906B2Mar 28, 2006
Chemical mechanical polishing for forming a shallow trench isolation structure
UNITED MICROELECTRONICS CORP10 citations74
US6448159B1Sep 10, 2002
Chemical mechanical polishing for forming a shallow trench isolation structure
UNITED MICROELECTRONICS CORP6 citations74
US6316330B1Nov 13, 2001
Method of fabricating a shallow trench isolation semiconductor device
UNITED MICROELECTRONICS CORP7 citations74
US6232161B1May 15, 2001
Method for forming a dummy active pattern
UNITED MICROELECTRONICS CORP10 citations74
US6228209B1May 8, 2001
Equipment for forming a glue layer of an opening
UNITED MICROELECTRONICS CORP6 citations74
US6177332B1Jan 23, 2001
Method of manufacturing shallow trench isolation
UNITED MICROELECTRONICS CORP10 citations74
US6133083AOct 17, 2000
Method to fabricate embedded DRAM
UNITED MICROELECTRONICS CORP9 citations74
US6117743ASep 12, 2000
Method of manufacturing MOS device using anti reflective coating
UNITED MICROELECTRONICS CORP13 citations74
US6063689AMay 16, 2000
Method for forming an isolation
UNITED MICROELECTRONICS CORP11 citations74
US6015755AJan 18, 2000
Method of fabricating a trench isolation structure using a reverse mask
UNITED MICROELECTRONICS CORP15 citations74
US5976984ANov 2, 1999
Process of making unlanded vias
UNITED MICROELECTRONICS CORP10 citations74
US7001713B2Feb 21, 2006
Method of forming partial reverse active mask
UNITED MICROELECTRONICS CORP2 citations63
US6486040B2Nov 26, 2002
Chemical mechanical polishing for forming a shallow trench isolation structure
UNITED MICROELECTRONICS CORP2 citations63
US6365471B1Apr 2, 2002
Method for producing PMOS devices
UNITED MICROELECTRONICS CORP3 citations63
US6323105B1Nov 27, 2001
Method for fabricating an isolation structure including a shallow trench isolation structure and a local-oxidation isolation structure
UNITED MICROELECTRONICS CORP4 citations63
US6291111B1Sep 18, 2001
Method of trench polishing
UNITED MICROELECTRONICS CORP2 citations63
US6277699B1Aug 21, 2001
Method for forming a metal-oxide-semiconductor transistor
UNITED MICROELECTRONICS CORP6 citations63
US6810511B2Oct 26, 2004
Method of designing active region pattern with shift dummy pattern
UNITED MICROELECTRONICS CORP0 citations52