Inventor

MIN YOUNG-GI

KR2 patents

Patents

2 patents

US9983229B2May 29, 2018

Test socket for testing semiconductor chip package and method of manufacturing the same

SAMSUNG ELECTRONICS CO LTD1 citations47

US10470315B2Nov 5, 2019

Manufacturing method of test socket and test method for semiconductor package

SAMSUNG ELECTRONICS CO LTD0 citations45