Inventor
CHANG SHYH-MING
TW33 patents
⚠️ This page may combine multiple inventors who share the name “CHANG SHYH-MING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IND TECH RES INST
25 patentsUS5707902AJan 13, 1998
Composite bump structure and methods of fabrication
IND TECH RES INST120 citations99
US6084301AJul 4, 2000
Composite bump structures
IND TECH RES INST101 citations98
US5578527ANov 26, 1996
Connection construction and method of manufacturing the same
IND TECH RES INST107 citations97
US5431328AJul 11, 1995
Composite bump flip chip bonding
IND TECH RES INST217 citations97
US6249051B1Jun 19, 2001
Composite bump flip chip bonding
IND TECH RES INST86 citations96
US5749997AMay 12, 1998
Composite bump tape automated bonding method and bonded structure
IND TECH RES INST95 citations96
US7300865B2Nov 27, 2007
Method for bonding IC chips to substrates incorporating dummy bumps and non-conductive adhesive
IND TECH RES INST53 citations95
US6972490B2Dec 6, 2005
Bonding structure with compliant bumps
IND TECH RES INST65 citations95
US6919642B2Jul 19, 2005
Method for bonding IC chips to substrates incorporating dummy bumps and non-conductive adhesive and structures formed
IND TECH RES INST66 citations95
US6537854B1Mar 25, 2003
Method for bonding IC chips having multi-layered bumps with corrugated surfaces and devices formed
IND TECH RES INST69 citations95
US5393697AFeb 28, 1995
Composite bump structure and methods of fabrication
IND TECH RES INST91 citations94
US6605491B1Aug 12, 2003
Method for bonding IC chips to substrates with non-conductive adhesive
IND TECH RES INST30 citations92
US6365500B1Apr 2, 2002
Composite bump bonding
IND TECH RES INST40 citations92
US6767818B1Jul 27, 2004
Method for forming electrically conductive bumps and devices formed
IND TECH RES INST34 citations91
US5861661AJan 19, 1999
Composite bump tape automated bonded structure
IND TECH RES INST36 citations91
US7988808B2Aug 2, 2011
Bonding structure with buffer layer and method of forming the same
IND TECH RES INST11 citations84
US7154176B2Dec 26, 2006
Conductive bumps with non-conductive juxtaposed sidewalls
IND TECH RES INST13 citations81
US6024274AFeb 15, 2000
Method for tape automated bonding to composite bumps
IND TECH RES INST15 citations72
US5127573AJul 7, 1992
Tape automated bonding apparatus with automatic leveling stage
IND TECH RES INST18 citations72
US7459055B2Dec 2, 2008
Bonding structure with buffer layer and method of forming the same
IND TECH RES INST2 citations62
US7183494B2Feb 27, 2007
Bonding structure with buffer layer and method of forming the same
IND TECH RES INST3 citations62
US7531900B2May 12, 2009
Package structure for electronic device
IND TECH RES INST3 citations61
US7348271B2Mar 25, 2008
Method for fabricating conductive bumps with non-conductive juxtaposed sidewalls
IND TECH RES INST2 citations60
US7446421B2Nov 4, 2008
Bonding structure with buffer layer and method of forming the same
IND TECH RES INST0 citations52
US7378746B2May 27, 2008
Composite bump
IND TECH RES INST0 citations50
TAIWAN TFT LCD ASS
5 patentsUS7834453B2Nov 16, 2010
Contact structure having a compliant bump and a test pad
TAIWAN TFT LCD ASS11 citations84
US7576430B2Aug 18, 2009
Bonding structure
TAIWAN TFT LCD ASS10 citations82
US7977788B2Jul 12, 2011
Contact structure having a compliant bump and a testing area
TAIWAN TFT LCD ASS8 citations81
US7449716B2Nov 11, 2008
Bond quality indication by bump structure on substrate
TAIWAN TFT LCD ASS11 citations81
US7871918B2Jan 18, 2011
Manufacturing method of contact structure
TAIWAN TFT LCD ASS2 citations63