Inventor
WU CHI-YUAN
TW5 patents
⚠️ This page may combine multiple inventors who share the name “WU CHI-YUAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IND TECH RES INST
2 patentsUS6537854B1Mar 25, 2003
Method for bonding IC chips having multi-layered bumps with corrugated surfaces and devices formed
IND TECH RES INST69 citations95
US6373545B1Apr 16, 2002
Repairable TFT-LCD assembly and method for making in which a separation tape positioned between two anisotropic conductive films
IND TECH RES INST5 citations60