Inventor

HORI YUKITAKA

JP3 patents

Patents

3 patents

US7012332B2Mar 14, 2006

Semiconductor device having sealing structure for wide gap type semiconductor chip

MITSUBISHI ELECTRIC CORP6 citations58

US11495667B2Nov 8, 2022

Semiconductor device

MITSUBISHI ELECTRIC CORP0 citations54

US7867829B2Jan 11, 2011

Semiconductor device manufacturing method, semiconductor wafer, and semiconductor device

MITSUBISHI ELECTRIC CORP2 citations54