Inventor
YEH WEI-CHIH
TW5 patents
⚠️ This page may combine multiple inventors who share the name “YEH WEI-CHIH”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
LAW OSCAR M K
3 patentsUS8549460B2Oct 1, 2013
Supplying power to integrated circuits using a grid matrix formed of through-silicon vias
LAW OSCAR M K16 citations91
US8264067B2Sep 11, 2012
Through silicon via (TSV) wire bond architecture
LAW OSCAR M K20 citations91
US8247906B2Aug 21, 2012
Supplying power to integrated circuits using a grid matrix formed of through-silicon vias
LAW OSCAR M K25 citations91