Inventor
BELADY CHRISTIAN L
US161 patents
⚠️ This page may combine multiple inventors who share the name “BELADY CHRISTIAN L”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HEWLETT PACKARD DEVELOPMENT CO
30 patentsUS7511959B2Mar 31, 2009
Scalable computing apparatus
HEWLETT PACKARD DEVELOPMENT CO147 citations99
US6776578B2Aug 17, 2004
Winglet-enhanced fan
HEWLETT PACKARD DEVELOPMENT CO172 citations99
US7791889B2Sep 7, 2010
Redundant power beneath circuit board
HEWLETT PACKARD DEVELOPMENT CO118 citations98
US7236363B2Jun 26, 2007
Liquid cooled system module
HEWLETT PACKARD DEVELOPMENT CO69 citations98
US7212409B1May 1, 2007
Cam actuated cold plate
HEWLETT PACKARD DEVELOPMENT CO78 citations96
US6816378B1Nov 9, 2004
Stack up assembly
HEWLETT PACKARD DEVELOPMENT CO40 citations96
US6771507B1Aug 3, 2004
Power module for multi-chip printed circuit boards
HEWLETT PACKARD DEVELOPMENT CO55 citations96
US6580610B2Jun 17, 2003
Integrated EMI containment and spray cooling module utilizing a magnetically coupled pump
HEWLETT PACKARD DEVELOPMENT CO55 citations96
US6819562B2Nov 16, 2004
Cooling apparatus for stacked components
HEWLETT PACKARD DEVELOPMENT CO57 citations95
US8051671B2Nov 8, 2011
System and method for cooling computers
HEWLETT PACKARD DEVELOPMENT CO52 citations94
US7929310B2Apr 19, 2011
Cell board interconnection architecture
HEWLETT PACKARD DEVELOPMENT CO21 citations93
US7821792B2Oct 26, 2010
Cell board interconnection architecture
HEWLETT PACKARD DEVELOPMENT CO32 citations93
US7647787B2Jan 19, 2010
Upgradeable, modular data center cooling apparatus
HEWLETT PACKARD DEVELOPMENT CO41 citations93
US7403396B2Jul 22, 2008
Communicating with an electronic module that is slidably mounted in a system
HEWLETT PACKARD DEVELOPMENT CO17 citations93
US7379297B2May 27, 2008
Air flow regulation devices
HEWLETT PACKARD DEVELOPMENT CO19 citations93
US7327570B2Feb 5, 2008
Fluid cooled integrated circuit module
HEWLETT PACKARD DEVELOPMENT CO26 citations93
US6867976B2Mar 15, 2005
Pin retention for thermal transfer interfaces, and associated methods
HEWLETT PACKARD DEVELOPMENT CO21 citations93
US6809925B2Oct 26, 2004
Dual-purpose computer having gravity-actuated fan speed control
HEWLETT PACKARD DEVELOPMENT CO34 citations93
US7730365B1Jun 1, 2010
Workload management for maintaining redundancy of non-data computer components
HEWLETT PACKARD DEVELOPMENT CO22 citations92
US7646109B2Jan 12, 2010
System for distributing AC power within an equipment rack
HEWLETT PACKARD DEVELOPMENT CO21 citations92
US7539881B2May 26, 2009
System and method for dynamically adjusting power caps for electronic components based on power consumption
HEWLETT PACKARD DEVELOPMENT CO40 citations92
US7499281B2Mar 3, 2009
Multi-chip module with power system
HEWLETT PACKARD DEVELOPMENT CO35 citations92
US7345885B2Mar 18, 2008
Heat spreader with multiple stacked printed circuit boards
HEWLETT PACKARD DEVELOPMENT CO38 citations92
US7336490B2Feb 26, 2008
Multi-chip module with power system
HEWLETT PACKARD DEVELOPMENT CO38 citations92
US7286352B2Oct 23, 2007
Thermally expanding base of heatsink to receive fins
HEWLETT PACKARD DEVELOPMENT CO28 citations92
US7120022B2Oct 10, 2006
Loop thermosyphon with wicking structure and semiconductor die as evaporator
HEWLETT PACKARD DEVELOPMENT CO19 citations92
US7096926B2Aug 29, 2006
Thermal pouch interface
HEWLETT PACKARD DEVELOPMENT CO21 citations92
US7072185B1Jul 4, 2006
Electronic module for system board with pass-thru holes
HEWLETT PACKARD DEVELOPMENT CO27 citations92
US7068515B2Jun 27, 2006
Multi-chip module with stacked redundant power
HEWLETT PACKARD DEVELOPMENT CO46 citations92
US7002801B2Feb 21, 2006
Method of cooling semiconductor die using microchannel thermosyphon
HEWLETT PACKARD DEVELOPMENT CO19 citations92
HEWLETT PACKARD CO
9 patentsUS6517315B2Feb 11, 2003
Enhanced performance fan with the use of winglets
HEWLETT PACKARD CO304 citations99
US6377453B1Apr 23, 2002
Field replaceable module with enhanced thermal interface
HEWLETT PACKARD CO92 citations98
US6133631AOct 17, 2000
Semiconductor package lid with internal heat pipe
HEWLETT PACKARD CO114 citations98
US6452789B1Sep 17, 2002
Packaging architecture for 32 processor server
HEWLETT PACKARD CO133 citations97
US6377458B1Apr 23, 2002
Integrated EMI containment and spray cooling module utilizing a magnetically coupled pump
HEWLETT PACKARD CO51 citations96
US6285550B1Sep 4, 2001
Sub-cooled processor and companion voltage regulator
HEWLETT PACKARD CO67 citations96
US6191945B1Feb 20, 2001
Cold plate arrangement for cooling processor and companion voltage regulator
HEWLETT PACKARD CO69 citations96
US6507492B2Jan 14, 2003
Integrated EMI containment and spray cooling module utilizing a magnetically coupled pump
HEWLETT PACKARD CO18 citations93
US5927944AJul 27, 1999
Fan with blades having integral rotating venturi
HEWLETT PACKARD CO23 citations93
BELADY CHRISTIAN L
5 patentsUS8849469B2Sep 30, 2014
Data center system that accommodates episodic computation
BELADY CHRISTIAN L50 citations95
US9252598B2Feb 2, 2016
Data plant—a raw material powered data generator
BELADY CHRISTIAN L35 citations94
US8104041B2Jan 24, 2012
Computer workload redistribution based on prediction from analysis of local resource utilization chronology data
BELADY CHRISTIAN L41 citations93
US8490103B1Jul 16, 2013
Allocating computer processes to processor cores as a function of process utilizations
BELADY CHRISTIAN L23 citations92
US8395896B2Mar 12, 2013
Redundant cooling systems and methods
BELADY CHRISTIAN L19 citations92
MICROSOFT CORP
2 patentsLIEBERT CORP
1 patentSANKAR SRIRAM
1 patentHORVITZ ERIC J
1 patentPETERSON ERIC C
1 patentShowing the top 50 of 161 patents by PatentIndex Score.