P

Inventor

YAMAZAKI OSAMU

JP94 patents
⚠️ This page may combine multiple inventors who share the name “YAMAZAKI OSAMU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD

14 patents
US4877677AOct 31, 1989

Wear-protected device

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD118 citations95
US4980339ADec 25, 1990

Superconductor structure

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD33 citations93
US4870632ASep 26, 1989

Optical head with astigmatic reflecting element

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD25 citations93
US6371017B1Apr 16, 2002

Printing method and printing apparatus

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD24 citations92
US5999920ADec 7, 1999

System for assisting in management of packaging plant

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD39 citations92
US4315960AFeb 16, 1982

Method of making a thin film

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD38 citations92
US6402011B1Jun 11, 2002

Reflow method and reflow device

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD19 citations90
US6145734ANov 14, 2000

Reflow method and reflow device

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD40 citations90
US4735910AApr 5, 1988

In-situ doping of MBE grown II-VI compounds on a homo- or hetero-substrate

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD20 citations82
US4731172AMar 15, 1988

Method for sputtering multi-component thin-film

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD20 citations82
US4223286ASep 16, 1980

Surface acoustic wave resonator

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD21 citations82
US3988232AOct 26, 1976

Method of making crystal films

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD26 citations82
US5791484AAug 11, 1998

Assembly of chip parts

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD10 citations74
US4354130AOct 12, 1982

Surface acoustic wave device using a multi-layer substrate including α2 O3, SiO and ZnO

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD18 citations74

LINTEC CORP

13 patents
US6977024B2Dec 20, 2005

Method for manufacturing semiconductor device using adhesive sheet with embedded conductor bodies

LINTEC CORP23 citations93
US6753614B2Jun 22, 2004

Semiconductor chip carrying adhesive tape/sheet, semiconductor chip carrier, and semiconductor chip packaging body

LINTEC CORP23 citations93
US6919262B2Jul 19, 2005

Process for producing semiconductor chips

LINTEC CORP38 citations92
US6924211B2Aug 2, 2005

Semiconductor chip carrying adhesive tape/sheet, semiconductor chip carrier, semiconductor chip mounting method and semiconductor chip packaging body

LINTEC CORP16 citations90
US7135224B2Nov 14, 2006

Adhesive tape

LINTEC CORP21 citations89
US8003441B2Aug 23, 2011

Manufacturing method of semiconductor device

LINTEC CORP9 citations84
US8034667B2Oct 11, 2011

Semiconductor sealing resin sheet and semiconductor device manufacturing method using the same

LINTEC CORP12 citations83
US7408259B2Aug 5, 2008

Sheet to form a protective film for chips

LINTEC CORP4 citations74
US7235465B2Jun 26, 2007

Process for producing semiconductor chips having a protective film on the back surface

LINTEC CORP6 citations74
US7169648B2Jan 30, 2007

Process for producing a semiconductor device

LINTEC CORP8 citations74
US6911720B2Jun 28, 2005

Semiconductor device adhesive sheet with conductor bodies buried therein

LINTEC CORP8 citations74
US6900550B2May 31, 2005

Semiconductor device including adhesive agent layer with embedded conductor bodies

LINTEC CORP7 citations74
US6855418B2Feb 15, 2005

Tape for forming resin tie bar, resin tie bar, lead frame equipped with resin tie bar, resin-molded semiconductor device, and method for producing same

LINTEC CORP8 citations74

PIONEER CORP

5 patents

SEIKO INSTR INC

3 patents

FUJITSU LTD

3 patents

TOSHIBA KK

2 patents

OSAKA GAS CO LTD

2 patents

TEXAS INSTRUMENTS INC

2 patents

SEIKO INSTR R & D CT INC

1 patent

NEC CORP

1 patent

FANUC LTD

1 patent

SHARP KK

1 patent

SHIBAURA MECHATRONICS CORP

1 patent

KOMATSU MFG CO LTD

1 patent

Showing the top 50 of 94 patents by PatentIndex Score.