Inventor
KIM WON-YOUNG
KR46 patents
⚠️ This page may combine multiple inventors who share the name “KIM WON-YOUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
19 patentsUS10679956B2Jun 9, 2020
Semiconductor memory chip, semiconductor memory package, and electronic system using the same
SAMSUNG ELECTRONICS CO LTD4 citations73
US10985138B2Apr 20, 2021
Semiconductor package having a plurality of chips and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD2 citations72
US9859204B2Jan 2, 2018
Semiconductor devices with redistribution pads
SAMSUNG ELECTRONICS CO LTD2 citations72
US9070824B2Jun 30, 2015
Heterogeneous laminate including graphene, and thermoelectric material, thermoelectric module, and thermoelectric apparatus including the heterogeneous laminate
SAMSUNG ELECTRONICS CO LTD5 citations72
US12327821B2Jun 10, 2025
Semiconductor package having chip stack
SAMSUNG ELECTRONICS CO LTD0 citations62
US11916042B2Feb 27, 2024
Semiconductor package having chip stack
SAMSUNG ELECTRONICS CO LTD0 citations62
US10930618B2Feb 23, 2021
Semiconductor package having chip stack
SAMSUNG ELECTRONICS CO LTD0 citations62
US11037894B2Jun 15, 2021
Semiconductor device having metal bump and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD0 citations61
US10714438B2Jul 14, 2020
Semiconductor device having metal bump and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD1 citations61
US10622231B2Apr 14, 2020
Method of manufacturing semiconductor package
SAMSUNG ELECTRONICS CO LTD1 citations53
US10269740B2Apr 23, 2019
Semiconductor memory chip, semiconductor memory package, and electronic system using the same
SAMSUNG ELECTRONICS CO LTD0 citations52
US9554467B2Jan 24, 2017
Printed circuit board and semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations52
US12165974B2Dec 10, 2024
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations51
US10024585B2Jul 17, 2018
Heat radiation-thermoelectric fin, and thermoelectric module and thermoelectric apparatus including the heat radiation-thermoelectric fin
SAMSUNG ELECTRONICS CO LTD0 citations51
US10784216B2Sep 22, 2020
Semiconductor device and semiconductor package including the same
SAMSUNG ELECTRONICS CO LTD0 citations49
US10297559B2May 21, 2019
Semiconductor device and semiconductor package including the same
SAMSUNG ELECTRONICS CO LTD0 citations49
US10141255B2Nov 27, 2018
Circuit boards and semiconductor packages including the same
SAMSUNG ELECTRONICS CO LTD0 citations49
US10002822B2Jun 19, 2018
Circuit boards and semiconductor packages including the same
SAMSUNG ELECTRONICS CO LTD0 citations49
US9871180B2Jan 16, 2018
Thermoelectric material and thermoelectric device including the same
SAMSUNG ELECTRONICS CO LTD0 citations39
LOTTE CHEMICAL CORP
4 patentsUS12123550B2Oct 22, 2024
High pressure tank having hoop layer and helical layer wound thereon and method of manufacturing same
LOTTE CHEMICAL CORP1 citations59
US12038134B2Jul 16, 2024
Knob cap for high-pressure tank
LOTTE CHEMICAL CORP0 citations58
US12031681B2Jul 9, 2024
Knob cap for high-pressure tank
LOTTE CHEMICAL CORP0 citations58
US11598487B2Mar 7, 2023
Sealing apparatus for high-pressure tank and high-pressure tank comprising same
LOTTE CHEMICAL CORP0 citations49
CUCKOO ELECTRONICS CO LTD
4 patentsUS10827870B2Nov 10, 2020
Electric cooker
CUCKOO ELECTRONICS CO LTD1 citations59
US10736457B2Aug 11, 2020
Electric cooker
CUCKOO ELECTRONICS CO LTD1 citations57
US10722064B2Jul 28, 2020
Electric cooker
CUCKOO ELECTRONICS CO LTD1 citations57
US10863850B2Dec 15, 2020
Electric cooker
CUCKOO ELECTRONICS CO LTD0 citations40