P

Inventor

KIM WON-YOUNG

KR46 patents
⚠️ This page may combine multiple inventors who share the name “KIM WON-YOUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRONICS CO LTD

19 patents
US10679956B2Jun 9, 2020

Semiconductor memory chip, semiconductor memory package, and electronic system using the same

SAMSUNG ELECTRONICS CO LTD4 citations73
US10985138B2Apr 20, 2021

Semiconductor package having a plurality of chips and method of manufacturing the same

SAMSUNG ELECTRONICS CO LTD2 citations72
US9859204B2Jan 2, 2018

Semiconductor devices with redistribution pads

SAMSUNG ELECTRONICS CO LTD2 citations72
US9070824B2Jun 30, 2015

Heterogeneous laminate including graphene, and thermoelectric material, thermoelectric module, and thermoelectric apparatus including the heterogeneous laminate

SAMSUNG ELECTRONICS CO LTD5 citations72
US12327821B2Jun 10, 2025

Semiconductor package having chip stack

SAMSUNG ELECTRONICS CO LTD0 citations62
US11916042B2Feb 27, 2024

Semiconductor package having chip stack

SAMSUNG ELECTRONICS CO LTD0 citations62
US10930618B2Feb 23, 2021

Semiconductor package having chip stack

SAMSUNG ELECTRONICS CO LTD0 citations62
US11037894B2Jun 15, 2021

Semiconductor device having metal bump and method of manufacturing the same

SAMSUNG ELECTRONICS CO LTD0 citations61
US10714438B2Jul 14, 2020

Semiconductor device having metal bump and method of manufacturing the same

SAMSUNG ELECTRONICS CO LTD1 citations61
US10622231B2Apr 14, 2020

Method of manufacturing semiconductor package

SAMSUNG ELECTRONICS CO LTD1 citations53
US10269740B2Apr 23, 2019

Semiconductor memory chip, semiconductor memory package, and electronic system using the same

SAMSUNG ELECTRONICS CO LTD0 citations52
US9554467B2Jan 24, 2017

Printed circuit board and semiconductor package

SAMSUNG ELECTRONICS CO LTD0 citations52
US12165974B2Dec 10, 2024

Semiconductor package

SAMSUNG ELECTRONICS CO LTD0 citations51
US10024585B2Jul 17, 2018

Heat radiation-thermoelectric fin, and thermoelectric module and thermoelectric apparatus including the heat radiation-thermoelectric fin

SAMSUNG ELECTRONICS CO LTD0 citations51
US10784216B2Sep 22, 2020

Semiconductor device and semiconductor package including the same

SAMSUNG ELECTRONICS CO LTD0 citations49
US10297559B2May 21, 2019

Semiconductor device and semiconductor package including the same

SAMSUNG ELECTRONICS CO LTD0 citations49
US10141255B2Nov 27, 2018

Circuit boards and semiconductor packages including the same

SAMSUNG ELECTRONICS CO LTD0 citations49
US10002822B2Jun 19, 2018

Circuit boards and semiconductor packages including the same

SAMSUNG ELECTRONICS CO LTD0 citations49
US9871180B2Jan 16, 2018

Thermoelectric material and thermoelectric device including the same

SAMSUNG ELECTRONICS CO LTD0 citations39

LOTTE CHEMICAL CORP

4 patents

CUCKOO ELECTRONICS CO LTD

4 patents

SAMSUNG ATOFINA CO LTD

2 patents

SAMSUNG GENERAL CHEMICALS CO

2 patents

FIBERFOX INC

2 patents

HWANG SE HEE

2 patents

SAMSUNG SDS CO LTD

2 patents

SAMSUNG HEAVY IND

1 patent

LS CABLE & SYSTEM LTD

1 patent

KIM DO-HYUN

1 patent

SAMSUNG TOTAL PETROCHEMICALS

1 patent

SEMES CO LTD

1 patent

OPTRONTEC CO LTD

1 patent

ELECTRONICS & TELECOMMUNICATIONS RES INST

1 patent

SUH JEONG KWON

1 patent

KIM WON YOUNG

1 patent