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Inventor
EUN KYOUNG TAE
KR
2 patents
Patents
2 patents
US10811359B2
Oct 20, 2020
Stack packages relating to bridge die
SK HYNIX INC
1 citations
54
US11430763B2
Aug 30, 2022
Semiconductor packages including stack modules comprised of interposing bridges and semiconductor dies
SK HYNIX INC
0 citations
44