Inventor
JEONG TAESUNG
KR7 patents
Patents
7 patentsUS11784129B2Oct 10, 2023
Semiconductor package and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD2 citations71
US11088115B2Aug 10, 2021
Interposer and semiconductor package including the same
SAMSUNG ELECTRONICS CO LTD4 citations68
US12334445B2Jun 17, 2025
Method of fabricating a semiconductor package
SAMSUNG ELECTRONICS CO LTD1 citations62
US12453107B2Oct 21, 2025
Semiconductor device and semiconductor package including the same
SAMSUNG ELECTRONICS CO LTD0 citations61
US12218099B2Feb 4, 2025
Interposer and semiconductor package including the same
SAMSUNG ELECTRONICS CO LTD0 citations57
US12575418B2Mar 10, 2026
Semiconductor packages having organic material layer between through-via structure and encapsulant that surrounds a portion of semiconductor chip
SAMSUNG ELECTRONICS CO LTD0 citations49
US11676915B2Jun 13, 2023
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations44