Inventor
EGUCHI SHUJI
JP43 patents
⚠️ This page may combine multiple inventors who share the name “EGUCHI SHUJI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HITACHI LTD
33 patentsUS6627997B1Sep 30, 2003
Semiconductor module and method of mounting
HITACHI LTD124 citations98
US6028364AFeb 22, 2000
Semiconductor device having a stress relieving mechanism
HITACHI LTD167 citations98
US6114005ASep 5, 2000
Laminate and multilayer printed circuit board
HITACHI LTD98 citations97
US5914531AJun 22, 1999
Semiconductor device having a ball grid array package structure using a supporting frame
HITACHI LTD68 citations96
US5677045AOct 14, 1997
Laminate and multilayer printed circuit board
HITACHI LTD86 citations96
US6114753ASep 5, 2000
Circuit tape having adhesive film, semiconductor device, and a method for manufacturing the same
HITACHI LTD50 citations95
US6097100AAug 1, 2000
Resin sealed semiconductor devices and a process for manufacturing the same
HITACHI LTD56 citations94
US5602420AFeb 11, 1997
Stacked high mounting density semiconductor devices
HITACHI LTD65 citations94
US6784541B2Aug 31, 2004
Semiconductor module and mounting method for same
HITACHI LTD37 citations93
US6130112AOct 10, 2000
Semiconductor device
HITACHI LTD20 citations93
US6049128AApr 11, 2000
Semiconductor device
HITACHI LTD21 citations93
US7359212B2Apr 15, 2008
Control device and method of manufacturing thereof
HITACHI LTD16 citations92
US6515371B2Feb 4, 2003
Semiconductor device with elastic structure and wiring
HITACHI LTD13 citations92
US6433440B1Aug 13, 2002
Semiconductor device having a porous buffer layer for semiconductor device
HITACHI LTD24 citations92
US6423571B2Jul 23, 2002
Method of making a semiconductor device having a stress relieving mechanism
HITACHI LTD35 citations92
US6371664B2Apr 16, 2002
Photoelectronic device and method of manufacturing the same
HITACHI LTD17 citations92
US6307269B1Oct 23, 2001
Semiconductor device with chip size package
HITACHI LTD32 citations92
US6282350B1Aug 28, 2001
Photoelectronic device and method of manufacturing the same
HITACHI LTD35 citations92
US6114192ASep 5, 2000
Method of manufacturing a semiconductor device having a ball grid array package structure using a supporting frame
HITACHI LTD39 citations92
US4946242AAug 7, 1990
Optical part including integral combination of optical fiber and light emitting or receiving element and method of manufacturing the same
HITACHI LTD34 citations92
US4585841AApr 29, 1986
Transparent resin material containing metallic atoms bonded to pendent carboxylic acid groups
HITACHI LTD30 citations92
US7445455B2Nov 4, 2008
Electronic device
HITACHI LTD17 citations84
US6791194B1Sep 14, 2004
Circuit tape having adhesive film, semiconductor device, and a method for manufacturing the same
HITACHI LTD18 citations83
US6586105B2Jul 1, 2003
Packaging structure and method for automotive components
HITACHI LTD14 citations83
US5113477AMay 12, 1992
Plastic optical fibers from polymers derived from metallic salts of ethylenic carboxyl monomers
HITACHI LTD20 citations82
US6639323B2Oct 28, 2003
Semiconductor device and its manufacturing method
HITACHI LTD6 citations73
US4873030AOct 10, 1989
Method of molding a resinous optical transmitting element
HITACHI LTD12 citations73
US4810048AMar 7, 1989
Mechanical part mounting chassis with integrated circuit
HITACHI LTD6 citations68
US7554039B2Jun 30, 2009
Electronic device
HITACHI LTD5 citations63
US6297073B1Oct 2, 2001
Semiconductor device
HITACHI LTD1 citations63
US7924572B2Apr 12, 2011
Control device and method of manufacturing thereof
HITACHI LTD5 citations62
US7303406B2Dec 4, 2007
Device for controlling a vehicle
HITACHI LTD2 citations61
US7530819B2May 12, 2009
Device for controlling a vehicle
HITACHI LTD0 citations51
RENESAS TECH CORP
7 patentsUS6940162B2Sep 6, 2005
Semiconductor module and mounting method for same
RENESAS TECH CORP23 citations93
US6888230B1May 3, 2005
Semiconductor device, semiconductor wafer, semiconductor module, and a method of manufacturing semiconductor device
RENESAS TECH CORP16 citations92
US7202570B2Apr 10, 2007
Circuit tape having adhesive film semiconductor device and a method for manufacturing the same
RENESAS TECH CORP6 citations73
US6686226B1Feb 3, 2004
Method of manufacturing a semiconductor device a ball grid array package structure using a supporting frame
RENESAS TECH CORP9 citations73
US7217992B2May 15, 2007
Semiconductor device, semiconductor wafer, semiconductor module, and a method of manufacturing semiconductor device
RENESAS TECH CORP3 citations63
US7038325B2May 2, 2006
Wiring tape for semiconductor device including a buffer layer having interconnected foams
RENESAS TECH CORP3 citations63
US6861294B2Mar 1, 2005
Semiconductor devices and methods of making the devices
RENESAS TECH CORP4 citations62