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Inventor
KAW RAVINDHAR K
US
4 patents
⚠️ This page may combine multiple inventors who share the name “KAW RAVINDHAR K”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
AVAGO TECHNOLOGIES GENERAL IP
2 patents
US7262508B2
Aug 28, 2007
Integrated circuit incorporating flip chip and wire bonding
AVAGO TECHNOLOGIES GENERAL IP
5 citations
60
US7202546B2
Apr 10, 2007
Integrated circuit with copper interconnect and top level bonding/interconnect layer
AVAGO TECHNOLOGIES GENERAL IP
1 citations
50
AGILENT TECHNOLOGIES INC
1 patent
US6738583B1
May 18, 2004
Self-aligning infra-red communication link
AGILENT TECHNOLOGIES INC
12 citations
72
HEWLETT PACKARD CO
1 patent
US5021869A
Jun 4, 1991
Monolithic semiconductor chip interconnection technique and arrangement
HEWLETT PACKARD CO
6 citations
57