Inventor
MARUYAMA YUMI
JP3 patents
Patents
3 patentsUS7901967B2Mar 8, 2011
Dicing method for semiconductor substrate
DENSO CORP20 citations90
US9029960B2May 12, 2015
Semiconductor device and method of manufacturing the same
DENSO CORP3 citations55
US7838396B2Nov 23, 2010
Bonding method of semiconductor substrate and sheet, and manufacturing method of semiconductor chips using the same
DENSO CORP0 citations38