Inventor

KONING PAUL A

US45 patents

⚠️ This page may combine multiple inventors who share the name “KONING PAUL A”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

KONING PAUL A

INTEL CORP

Filled solder

Thermal interface apparatus, systems, and methods

Thermoelectric cooling for microelectronic packages and dice

Phase change material containing fusible particles as thermally conductive filler

Carbon-carbon and/or metal-carbon fiber composite heat spreaders

Carbon-carbon and/or metal-carbon fiber composite heat spreader

Phase change thermal interface materials including exfoliated clay

Polymer solder hybrid

Integrated heat spreader, heat sink or heat pipe with pre-attached phase change thermal interface material and method of making an electronic assembly

Integrated heat spreader, heat sink or heat pipe with pre-attached phase change thermal interface material and method of making an electronic assembly

Thermal interface material and electronic assembly having such a thermal interface material

Phase change material containing fusible particles as thermally conductive filler

Polymer matrices for polymer solder hybrid materials

Carbon-carbon and/or metal-carbon fiber composite heat spreaders

Polymer with solder pre-coated fillers for thermal interface materials

Gel thermal interface materials comprising fillers having low melting point and electronic packages comprising these gel thermal interface materials

Gel thermal interface materials comprising fillers having low melting point and electronic packages comprising these gel thermal interface materials

Semiconductor wafer coat layers and methods therefor

Nanotube modified solder thermal intermediate structure, systems, and methods

Semi-solid metal injection methods for electronic assembly thermal interface

Electronic assemblies with solidified thixotropic thermal interface material

Phase change material containing fusible particles as thermally conductive filler

Phase change thermal interface materials including polyester resin

Solder bumps formation using solder paste with shape retaining attribute

Polymeric dielectric material for high-energy density capacitors

Thermal intermediate apparatus, systems, and methods

No-flow underfill composition and method

Semiconductor wafer coat layers and methods therefor

Polymeric dielectric material for high-energy density capacitors

Carbon-carbon and/or metal-carbon fiber composite heat spreader

Component packaging apparatus, systems, and methods

Microelectronic packages including nanocomposite dielectric build-up materials and nanocomposite solder resist

Polymer matrices for polymer solder hybrid materials

Polymer matrices for polymer solder hybrid materials

No-flow underfill composition and method

Thermal intermediate apparatus, systems, and methods

Component packaging apparatus, systems, and methods

Embossing processes for substrate imprinting, structures made thereby, and polymers used therefor

AMOCO CORP

Poly(vinylalkylether)-containing hot-melt adhesives for polyethylene and polypropylene

Poly(vinylalkylether)-containing hot-melt adhesives for polyethylene and polypropylene

Poly(vinylalkylether)-containing hot melt adhesives for polyethllene and polypropylene

Liquid phase and aqueous solutions of poly(vinyl methyl ether) from highly purified vinyl methyl ether monomer

LI ERIC J

Semiconductor wafer coat layers and methods therefor

JAYARAMAN SAIKUMAR

Polymer matrices for polymer solder hybrid materials

KONING PAUL A

Nanotube modified solder thermal intermediate structure, systems, and methods