Inventor
CHIU YUAN SHENG
TW5 patents
Patents
5 patentsUS11011451B2May 18, 2021
Integrated circuit package and method
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations70
US12412805B2Sep 9, 2025
Semiconductor package
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US11996342B2May 28, 2024
Semiconductor package comprising heat dissipation plates
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US12080623B2Sep 3, 2024
Integrated circuit packages having mechanical brace standoffs
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations59
US12476140B2Nov 18, 2025
Semiconductor package including step seal ring and methods forming same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations41