Inventor
HAU-RIEGE CHRISTINE
US15 patents
⚠️ This page may combine multiple inventors who share the name “HAU-RIEGE CHRISTINE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ADVANCED MICRO DEVICES INC
11 patentsUS6822437B1Nov 23, 2004
Interconnect test structure with slotted feeder lines to prevent stress-induced voids
ADVANCED MICRO DEVICES INC53 citations96
US7451411B2Nov 11, 2008
Integrated circuit design system
ADVANCED MICRO DEVICES INC23 citations92
US6867056B1Mar 15, 2005
System and method for current-enhanced stress-migration testing of interconnect
ADVANCED MICRO DEVICES INC31 citations92
US6822473B1Nov 23, 2004
Determination of permeability of layer material within interconnect
ADVANCED MICRO DEVICES INC28 citations92
US6762597B1Jul 13, 2004
Structure, system, and method for assessing electromigration permeability of layer material within interconnect
ADVANCED MICRO DEVICES INC25 citations92
US6725433B1Apr 20, 2004
Method for assessing the reliability of interconnects
ADVANCED MICRO DEVICES INC26 citations92
US6714037B1Mar 30, 2004
Methodology for an assessment of the degree of barrier permeability at via bottom during electromigration using dissimilar barrier thickness
ADVANCED MICRO DEVICES INC23 citations92
US6818557B1Nov 16, 2004
Method of forming SiC capped copper interconnects with reduced hillock formation and improved electromigration resistance
ADVANCED MICRO DEVICES INC28 citations90
US7026225B1Apr 11, 2006
Semiconductor component and method for precluding stress-induced void formation in the semiconductor component
ADVANCED MICRO DEVICES INC8 citations71
US6768323B1Jul 27, 2004
System and method for determining location of extrusion in interconnect
ADVANCED MICRO DEVICES INC3 citations62
US7818655B1Oct 19, 2010
Method for quantitative detection of multiple electromigration failure modes
ADVANCED MICRO DEVICES INC1 citations52
INTEL CORP
3 patentsUS6667225B2Dec 23, 2003
Wafer-bonding using solder and method of making the same
INTEL CORP68 citations95
US7153774B2Dec 26, 2006
Method of making a semiconductor device that has copper damascene interconnects with enhanced electromigration reliability
INTEL CORP14 citations80
US6870262B2Mar 22, 2005
Wafer-bonding using solder and method of making the same
INTEL CORP2 citations62