Inventor
HONG JAE YOUNG
KR7 patents
⚠️ This page may combine multiple inventors who share the name “HONG JAE YOUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
5 patentsUS7374966B2May 20, 2008
Apparatus for stacking semiconductor chips, method for manufacturing semiconductor package using the same and semiconductor package manufactured thereby
SAMSUNG ELECTRONICS CO LTD5 citations69
US7396763B2Jul 8, 2008
Semiconductor package using flexible film and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD5 citations59
US7042104B2May 9, 2006
Semiconductor package using flexible film and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD4 citations59
US7135353B2Nov 14, 2006
Apparatus for stacking semiconductor chips, method for manufacturing semiconductor package using the same and semiconductor package manufactured thereby
SAMSUNG ELECTRONICS CO LTD5 citations58
US10638614B2Apr 28, 2020
Semiconductor package module
SAMSUNG ELECTRONICS CO LTD0 citations32