Inventor

KIRA HIDEHIKO

JP64 patents

⚠️ This page may combine multiple inventors who share the name “KIRA HIDEHIKO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

KIRA HIDEHIKO

FUJITSU LTD

Semiconductor chip element, semiconductor chip element mounting structure, semiconductor chip element mounting device and mounting method

Integrated circuit chip supporting and electrically connecting a head slider

Structure of mounting electronic component

Slider tester

Head assembly having integrated circuit chip covered by layer which prevents foreign particle generation

Method of mounting semiconductor chip

Method of producing a multichip package module in which rough-pitch and fine-pitch chips are mounted on a board

Semiconductor bare chip, method of manufacturing semiconductor bare chip and mounting structure of semiconductor bare chip

Method of producing a multichip package module in which rough-pitch and fine-pitch chips are mounted on a board

Head assembly, disk unit, and bonding method and apparatus

Method of mounting chip onto printed circuit board in shortened working time

Method of underfilling semiconductor device

Apparatus to produce a multichip package module in which rough-pitch and fine-pitch chips are mounted on a board

Semiconductor chip element, semiconductor chip element mounting structure, semiconductor chip element mounting device and mounting method

Method of ultrasonic mounting and ultrasonic mounting apparatus using the same

Method of mounting semiconductor chip

Ultrasonic tool and ultrasonic bonder

Method of forming multi-piled bump

Resin coating method

Laminated semiconductor device and manufacturing method of laminated semiconductor device

Method of mounting semiconductor element, and semiconductor device

Method of manufacturing a semiconductor device

Slider tester

Head suspension, head assembly, and disk apparatus having a head IC mounted on a head suspension, and method for fitting a head IC to a head suspension

Semiconductor mounting apparatus, head thereof, and method for manufacturing laminated chip

Heating header of semiconductor mounting apparatus and bonding method for semiconductor

Magnetic head tester

Electronic device, electronic apparatus mounted with electronic device, article equipped with electronic device and method of producing electronic device

Electronic device, electronic apparatus mounted with electronic device, article equipped with electronic device and method of producing electronic device

RFID tag

Electronic device, electronic apparatus mounted with electronic device, article equipped with electronic device and method of producing electronic device

Electronic apparatus manufacturing method

Method of assembling a carriage assembly

Method of assembling a carriage assembly

Structure of mounting electronic component

Method of mounting electronic component

RFID tag and method of manufacturing the same

Method of ultrasonic-mounting electronic component and ultrasonic mounting machine

IC chip mounting method for mounting two or more IC chips by sequentially transferring the IC chips sucked onto a first roller to a second roller and mounting the IC chips transferred to the second roller on a traveling base

Mounting method of semiconductor device

Semiconductor bare chip, method of manufacturing semiconductor bare chip and mounting structure of semiconductor bare chip

Method of manufacturing an electronic component and an electronic device

Method of mounting an electronic component and mounting apparatus

Apparatus for observing an assembled state of components and method of observing an assembled state of components using such apparatus

Method of assembling a carriage assembly

Method for mounting electronic element on a circuit board

FUJITSU FRONTECH LTD

RFID tag

IC chip mounting method

YAMAKAMI TAKATOYO

Electronic packaging apparatus and electronic packaging method

TAKAHASHI TETSUYA

Electronic part with affixed MEMS