Inventor
GERMAN RANDY L
US3 patents
⚠️ This page may combine multiple inventors who share the name “GERMAN RANDY L”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MICROELECTRONICS & COMPUTER
2 patentsUS5508228AApr 16, 1996
Compliant electrically connective bumps for an adhesive flip chip integrated circuit device and methods for forming same
MICROELECTRONICS & COMPUTER211 citations94
US5830533ANov 3, 1998
Selective patterning of metallization on a dielectric substrate
MICROELECTRONICS & COMPUTER41 citations91