Inventor
MING DAVID CHAI YIH
SG2 patents
Patents
2 patentsUS7057281B2Jun 6, 2006
Microelectronic component assemblies employing lead frames having reduced-thickness inner lengths
MICRON TECHNOLOGY INC17 citations88
US7425470B2Sep 16, 2008
Microelectronic component assemblies employing lead frames having reduced-thickness inner lengths
MICRON TECHNOLOGY INC2 citations58