Inventor
YOO TAE WON
KR3 patents
Patents
3 patentsUS12237309B2Feb 25, 2025
Semiconductor package having pads with stepped structure
SAMSUNG ELECTRONICS CO LTD0 citations59
US11955464B2Apr 9, 2024
Semiconductor package having pads with stepped structure
SAMSUNG ELECTRONICS CO LTD0 citations59
US11574892B2Feb 7, 2023
Semiconductor package having pads with stepped structure
SAMSUNG ELECTRONICS CO LTD0 citations59