Inventor

BANG HYO-JAE

KR25 patents

⚠️ This page may combine multiple inventors who share the name “BANG HYO-JAE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

BANG HYO-JAE

SAMSUNG ELECTRONICS CO LTD

Lead frame unit, semiconductor package having a lead frame unit, stacked semiconductor package having a semiconductor package and methods of manufacturing the same

Memory device

Memory device

Semiconductor module with conductive element between chip packages

Super capacitor casing and supercapacitor embedded device

Memory device

Memory device

Memory device

Memory device

Memory device

Stacked semiconductor module, method of fabricating the same, and electronic system using the same

Semiconductor device and method of manufacturing the same

Pressure conductive sheet

Method of fabricating an electronic device

Semiconductor package having passive component and semiconductor memory module including the same

Printed circuit board of semiconductor package and method for mounting semiconductor package using the same

Semiconductor device and method of manufacturing the same

Semiconductor memory module with reverse mounted chip resistor

Memory modules and systems including the same

Data storage devices including multiple host interfaces and user devices including the same

BANG HYO-JAE

Device including circuit board with different form factor terminal sets and assemblies including the same

Fin-type heat sink for electronic component

Printed circuit board for memory module, method of manufacturing the same and memory module/socket assembly

Super capacitor casing and supercapacitor embedded device

Reworkable passive element embedded printed circuit board