Inventor
MOORE SCOTT P
US5 patents
Patents
5 patentsUS5572405ANov 5, 1996
Thermally enhanced ball grid array package
IBM98 citations94
US5243133ASep 7, 1993
Ceramic chip carrier with lead frame or edge clip
IBM61 citations94
US6059579AMay 9, 2000
Semiconductor structure interconnector and assembly
IBM25 citations92
US5288944AFeb 22, 1994
Pinned ceramic chip carrier
IBM54 citations84
US7737550B2Jun 15, 2010
Optimization of electronic package geometry for thermal dissipation
IBM10 citations82