Inventor

CHARNESKI LAWRENCE J

US28 patents

⚠️ This page may combine multiple inventors who share the name “CHARNESKI LAWRENCE J”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHARNESKI LAWRENCE J

SHARP LAB OF AMERICA INC

System and method of selectively cleaning copper substrate surfaces, in-situ, to remove copper oxides

Method of depositing a high-adhesive copper thin film on a metal nitride substrate

Enhanced CVD copper adhesion by two-step deposition process

Method of forming PrxCa1−xMnO3 thin films having a PrMnO3/CaMnO3 super lattice structure using metalorganic chemical vapor deposition

Low temperature MOCVD processes for fabrication of PrXCa1-xMnO3 thin films

Precursor with (methoxy) (methyl) silylolefin ligand to deposit copper and method same

Substituted ethylene precursor and synthesis method

System and method for forming a bipolar switching PCMO film

Copper metal precursor

Integrated circuit prepared by selectively cleaning copper substrates, in-situ, to remove copper oxides

In-situ method of cleaning a metal-organic chemical vapor deposition chamber

Substituted cycloalkene new copper precursors for chemical vapor deposition of copper metal thin films

System of selectively cleaning copper substrate surfaces, in-situ, to remove copper oxides

Substituted phenylethylene precursor and synthesis method

Copper adhered to a diffusion barrier surface

Differential copper deposition on integrated circuit surfaces

Nanorod sensor with single-plane electrodes

Bipolar switching PCMO capacitor

Substituted phenylethylene precursor deposition method

Substituted phenylethylene precursor synthesis method

SHARP MICROELECT TECH INC

Copper adhesion to a diffusion barrier surface and method for same

Differential copper deposition on integrated circuit surfaces and method for same

Method of using water vapor to increase the conductivity of cooper desposited with cu(hfac)TMVS

Precursor with (alkyloxy)(alkyl)-silylolefin ligand to deposit copper

Oxidized diffusion barrier surface for the adherence of copper and method for same

ADVANCED TECH MATERIALS

Adhesion promotion method for electro-chemical copper metallization in IC applications

Adhesion promotion method for CVD copper metallization in IC applications

Adhesion promotion method for CVD copper metallization in IC applications