Inventor

YEGNASHANKARAN VISVAMOHAN

US37 patents

⚠️ This page may combine multiple inventors who share the name “YEGNASHANKARAN VISVAMOHAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

YEGNASHANKARAN VISVAMOHAN

NAT SEMICONDUCTOR CORP

Method of forming a vertical MOS transistor

Semiconductor die with heat and electrical pipes

Semiconductor sensor device using MEMS technology

Convex image sensor and method of forming the sensor

High Q inductor in multi-level interconnect

Integrated circuit and method of forming the integrated circuit having a die with high Q inductors and capacitors attached to a die with a circuit as a flip chip

Silicon die with metal feed through structure

Low capacitance multilevel metal interconnect structure and method of manufacture

Apparatus and method for dicing semiconductor wafers

Cellular telephone handset with increased reception sensitivity and reduced transmit power levels

Semiconductor die with an integrated inductor

MEMS semiconductor sensor device

Method of selectively forming MEMS-based semiconductor devices at the end of a common fabrication process

Method of dicing a semiconductor wafer that substantially reduces the width of the saw street

Multilevel metal interconnect and method of forming the interconnect with capacitive structures that adjust the capacitance of the interconnect

Method of forming the integrated circuit having a die with high Q inductors and capacitors attached to a die with a circuit as a flip chip

Vertical MOS transistor

Radiation hardened MOS transistor

Method of forming a semiconductor die with heat and electrical pipes

Method of forming a MOS transistor with a layer of silicon germanium carbon

Bipolar transistor and method of forming the bipolar transistor with a backside contact

Method of forming a metal interconnect with capacitive structures that adjust the capacitance of the interconnect

Power supply with reduced power consumption when a load is disconnected from the power supply

Backside defect detector and method that determines whether unwanted materials are present on the backside of a semiconductor wafer

Semiconductor die with aluminum-spiked heat pipes

Method of forming a MOS transistor with a litho-less gate

Single-crystal silicon semiconductor structure

Hermetic seal for silicon die with metal feed through structure

Deep submicron MOS transistor with increased threshold voltage

World-wide distributed testing for integrated circuits

Method of forming a hermetic seal for silicon die with metal feed through structure

XIAO JIMMY YONG

Integrated circuit (IC) chip comprising an identification circuit

Identification circuit and IC chip comprising the same

LSI LOGIC CORP

Semiconductor chip having identification/encryption code

HOPPER PETER J

Self-propelled robotic device that moves through bodily and other passageways

YEGNASHANKARAN VISVAMOHAN

Method of forming a semiconductor die with aluminum-spiked heat pipes

PADMANABHAN GOBI R

Semiconductor wafer and die that include an integrated circuit and two or more different MEMS-based semiconductor devices