Inventor

ZAKEL ELKE

DE45 patents

⚠️ This page may combine multiple inventors who share the name “ZAKEL ELKE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

ZAKEL ELKE

FRAUNHOFER GES FORSCHUNG

Core metal soldering knob flip-chip technology

Method for bonding a flexible substrate to a chip

Method of contacting a chip

Method of soldering terminal faces, as well as a method of manufacturing a solder alloy

Thermal connecting structure for connecting materials with different expansion coefficients

Flip chip bonding with non conductive adhesive

Chip module with conductor paths on the chip bonding side of a chip carrier

Method of surface-contacting electronic components

Chip housing

Method and apparatus for testing chips

Method and apparatus for testing chips

Flux-free contacting of components

Method of joining electronic components to a substrate

Chip support arrangement and chip support for the manufacture of a chip casing

Method for forming a structured metallization on a semiconductor wafer

Process for remelting a contact surface metallization

PAC TECH GMBH

Chips arranged in plurality of planes and electrically connected to one another

Method and device for mutual contacting of two wafers

Process for the formation of a spatial chip arrangement and spatial chip arrangement

Device for removing solder material from a soldered joint

Contact bump construction for the production of a connector construction for substrate connecting surfaces

Method for alternately contacting two wafers

Method for producing a substrate arrangement

Device for applying solder globules

Bump with basic metallization and method for manufacturing the basic metallization

Method for ablating points of contact (debumping)

ZAKEL ELKE

Method for producing contactless chip cards and corresponding contactless chip card

Method for galvanic forming of bonding pads

Method and device for transferring a chip to a contact substrate

Chip-contacting method requiring no contact bumps, and electronic circuit produced in this way

Method and device for drying circuit substrates

Diode array and method for producing a diode array

Terminal face contact structure and method of making same

PAC TEC PACKAGING TECHNOLOGIES

Method and device for applying material to a workpiece

Method and device for applying pieces of material to a workpiece

Device for positioning a tool in relation to a workpiece

SMART PAC GMBH TECHNOLOGY SERV

Contact-bumpless chip contacting method and an electronic circuit produced by said method

Method for producing a contact substrate and corresponding contact substrate

PAC TECH & MDASH PACKAGING TECHNOLOGIES GMBH

Device for alternately contacting two wafers

Method and device for transferring a solder deposit configuration

FRANUNHOFER GES ZUR FOERDE RUN

Solder bump for flip chip assembly and method of its fabrication

FRAUNHOFER GES ZUR FORDERUNGDE

Process and device for forming raised metallised contacts

PAC TECH & MDASH PACKAGING TEC

Method and device for transferring a solder deposit configuration

SCHERING AG

Process for making a high temperature-resistant metal layer on a ceramic surface

BECKERT ERIK

Method for joining aligned discrete optical elements