Inventor

AZDASHT GHASSEM

DE53 patents

⚠️ This page may combine multiple inventors who share the name “AZDASHT GHASSEM”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

AZDASHT GHASSEM

PAC TECH GMBH

Chips arranged in plurality of planes and electrically connected to one another

Method and device for thermally connecting the contact surfaces of two substrates

Method and device for placing and remelting shaped pieces consisting of solder material

Method and device for mutual contacting of two wafers

Process for the formation of a spatial chip arrangement and spatial chip arrangement

Device and a method for applying a plurality of solder globules to a substrate

Method of attaching a component to a plate-shaped support

Method for alternately contacting two wafers

Method for producing a substrate arrangement

Device for applying solder globules

Method and device for applying a solder to a substrate

PAC TECH—PACKAGING TECH GMBH

Device for the separate application of connecting material deposits

Method for producing a chip module

Solder ball feeding device

Method and laser arrangement for fusing a solder material deposit by means of laser energy

Device for the separate application of solder material deposits

Device for removing a test contact of a test contact arrangement

Method for forming solder deposits

Semiconductor chip assembly and method for manufacturing the same

Device for the separate application of bonding material deposits

FRAUNHOFER GES FORSCHUNG

Multi-wavelength laser soldering device with substrate cleaning beam

Method for bonding a flexible substrate to a chip

Device for producing connections between two respective contact elements by means of laser energy

Process and apparatus for producing a bonded metal coating

Thermal connecting structure for connecting materials with different expansion coefficients

Chip module with conductor paths on the chip bonding side of a chip carrier

Chip housing

Method for forming a structured metallization on a semiconductor wafer

AZDASHT GHASSEM

Transfer device for receiving and transferring a solder ball arrangement

Device for positioning and contacting test contacts

Method and device for removing solder material deposits from a substrate

Device for applying an electronic component

Method of manufacturing a contact arrangement between a microelectronic component and a carrier

Method and device for electrically contacting terminal faces of two substrates by laser soldering using a gaseous flux medium

ZAKEL ELKE

Method and device for transferring a chip to a contact substrate

Method for producing a contactless chip card

Chip-contacting method requiring no contact bumps, and electronic circuit produced in this way

Method and device for drying circuit substrates

Diode array and method for producing a diode array

SMART PAC GMBH TECHNOLOGY SERV

Method for the production of a soldered connection

Chip module and chip card module for producing a chip card

Contact-bumpless chip contacting method and an electronic circuit produced by said method

Method for the production of a soldered joint

PAC TECH & MDASH PACKAGING TECHNOLOGIES GMBH

Device for alternately contacting two wafers

Method and device for transferring a solder deposit configuration

HEWLETT PACKARD CO

Connection of electrical contacts utilizing a combination laser and fiber optic push connect system

HEWLETT PACKARD DEVELOPMENT CO

Method of forming an electrical connection between electrical leads of a tab circuit and electrical contact bumps

FRAUNHOFER GES ZUR FORSCHUNG E

Method and apparatus for the bonding of a contact element

PAC TECH & MDASH PACKAGING TEC

Method and device for transferring a solder deposit configuration

PAC TECH PACKAGING TECH GMBH

Device for the separate application of solder material deposits