Inventor
KAMATH VINOD
US68 patents
⚠️ This page may combine multiple inventors who share the name “KAMATH VINOD”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
32 patentsUS7969736B1Jun 28, 2011
System for cooling memory modules
IBM78 citations98
US7961475B2Jun 14, 2011
Apparatus and method for facilitating immersion-cooling of an electronic subsystem
IBM80 citations98
US7836314B2Nov 16, 2010
Computer system performance estimator and layout configurator
IBM76 citations98
US7791882B2Sep 7, 2010
Energy efficient apparatus and method for cooling an electronics rack
IBM109 citations98
US7660109B2Feb 9, 2010
Apparatus and method for facilitating cooling of an electronics system
IBM69 citations98
US7639499B1Dec 29, 2009
Liquid cooling apparatus and method for facilitating cooling of an electronics system
IBM128 citations98
US7957148B1Jun 7, 2011
Low profile computer processor retention device
IBM66 citations97
US7660116B2Feb 9, 2010
Rack with integrated rear-door heat exchanger
IBM110 citations97
US7639486B2Dec 29, 2009
Rack system providing flexible configuration of computer systems with front access
IBM58 citations96
US6817405B2Nov 16, 2004
Apparatus having forced fluid cooling and pin-fin heat sink
IBM57 citations95
US6227516B1May 8, 2001
Quick-release mechanism for hard disk drive
IBM87 citations95
US6172871B1Jan 9, 2001
Method and system in a data processing system for efficiently cooling a portable computer system
IBM70 citations95
US6445580B1Sep 3, 2002
Adaptable heat dissipation device for a personal computer
IBM70 citations94
US6141216AOct 31, 2000
Quick-release hinge joint for heat pipe
IBM49 citations93
US9414523B2Aug 9, 2016
Cooled electronic system with liquid-cooled cold plate and thermal spreader coupled to electronic component
IBM15 citations92
US8385069B2Feb 26, 2013
Liquid coolant conduit secured in an unused socket for memory module cooling
IBM32 citations92
US7289331B2Oct 30, 2007
Interposable heat sink for adjacent memory modules
IBM23 citations92
US7116555B2Oct 3, 2006
Acoustic and thermal energy management system
IBM38 citations92
US6031716AFeb 29, 2000
Computer incorporating heat dissipator with hinged heat pipe arrangement for enhanced cooling capacity
IBM34 citations92
US5794687AAug 18, 1998
Forced air cooling apparatus for semiconductor chips
IBM42 citations92
US7342797B2Mar 11, 2008
Interposable heat sink for adjacent memory modules
IBM29 citations89
US9936607B2Apr 3, 2018
Fabricating cooled electronic system with liquid-cooled cold plate and thermal spreader
IBM9 citations84
US9930807B2Mar 27, 2018
Fabricating cooled electronic system with liquid-cooled cold plate and thermal spreader
IBM8 citations84
US9185830B2Nov 10, 2015
Thermoelectric-enhanced, liquid-based cooling of a multi-component electronic system
IBM12 citations84
US7612446B2Nov 3, 2009
Structures to enhance cooling of computer memory modules
IBM16 citations84
US7403393B2Jul 22, 2008
Apparatus and system for cooling heat producing components
IBM16 citations84
US7948196B2May 24, 2011
Plurality of configurable independent compute nodes sharing a fan assembly
IBM17 citations82
US7595986B2Sep 29, 2009
Controlling airflow in a computer chassis
IBM8 citations82
US7826215B2Nov 2, 2010
Ducted air temperature sensor
IBM17 citations79
US10045463B2Aug 7, 2018
Fabricating cooled electronic system with liquid-cooled cold plate and thermal spreader
IBM2 citations73
US9930806B2Mar 27, 2018
Cooled electronic system with liquid-cooled cold plate and thermal spreader coupled to electronic component
IBM3 citations73
US9132519B2Sep 15, 2015
Directly connected heat exchanger tube section and coolant-cooled structure
IBM5 citations73
CHAINER TIMOTHY J
5 patentsUS8493738B2Jul 23, 2013
Cooled electronic system with thermal spreaders coupling electronics cards to cold rails
CHAINER TIMOTHY J75 citations97
US8687364B2Apr 1, 2014
Directly connected heat exchanger tube section and coolant-cooled structure
CHAINER TIMOTHY J33 citations94
US9307674B2Apr 5, 2016
Cooled electronic system with liquid-cooled cold plate and thermal spreader coupled to electronic component
CHAINER TIMOTHY J18 citations92
US9027360B2May 12, 2015
Thermoelectric-enhanced, liquid-based cooling of a multi-component electronic system
CHAINER TIMOTHY J27 citations92
US8649177B2Feb 11, 2014
Method of fabricating a cooled electronic system
CHAINER TIMOTHY J28 citations92
LENOVO ENTPR SOLUTIONS SINGAPORE PTE LTD
3 patentsUS9668382B2May 30, 2017
Coolant distribution unit for a multi-node chassis
LENOVO ENTPR SOLUTIONS SINGAPORE PTE LTD16 citations84
US10111365B1Oct 23, 2018
Mounting electronic device to thermally conductive pad of liquid-cooling mechanism in translational movement-minimizing manner
LENOVO ENTPR SOLUTIONS SINGAPORE PTE LTD13 citations82
US11058027B2Jul 6, 2021
Systems and methods for controlling air distribution to electronic components
LENOVO ENTPR SOLUTIONS SINGAPORE PTE LTD3 citations73
BARINA RICHARD M
2 patentsKAMATH VINOD
2 patentsECKBERG ERIC A
1 patentDAVID MILNES P
1 patentBLAND PATRICK M
1 patentCANNEY BRIAN A
1 patentLENOVO SINGAPORE PTE LTD
1 patentCOX AARON R
1 patentShowing the top 50 of 68 patents by PatentIndex Score.