Inventor

DERSHEM STEPHEN M

US73 patents

⚠️ This page may combine multiple inventors who share the name “DERSHEM STEPHEN M”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

DERSHEM STEPHEN M

QUANTUM MATERIALS INC

Adhesive bonding composition with bond line limiting spacer system

Freeze resistant die-attach compositions

Resinless pseudoplastic bonding compositions

Resinless pseudoplastic bonding compositions

Bleed resistant cyanate ester-containing compositions

Bleed resistant cyanate ester-containing compositions

Bleed resistant cyanate ester-containing compositions

Solvent free die-attach compositions

Die-attach composition comprising polycyanate ester monomer

Non-ionic, water washable soldering paste

Silver-glass die attach paste with reduced resin

Propargyl ether-containing compositions useful for underfill applications

Perfluorinated hydrocarbon polymer-filled adhesive formulations and uses therefor

Water washable soldering paste

HENKEL CORP

Benzoxazines, thermosetting resins comprised thereof, and methods for use thereof

Benzoxazines, thermosetting resins comprised thereof, and methods for use thereof

Maleimide compounds in liquid form

Thermosetting resin compositions containing maleimide and/or vinyl compounds

Thermosetting resin compositions containing maleimide and/or vinyl compounds

Thermosetting resin compositions containing maleimide and/or vinyl compounds

Thermosetting resin compositions containing maleimide and/or vinyl compounds

Heterobifunctional monomers and uses therefor

Thermosetting resin compositions containing maleimide and/or vinyl compounds

Low shrinkage thermosetting resin compositions and methods of use therefor

Thermosetting resin compositions containing maleimide and/or vinyl compounds

Film adhesives containing maleimide compounds and methods for use thereof

Free radically polymerizable coupling agents

DESIGNER MOLECULES INC

Adhesive composition of phenol-functional polyamides

Imide-linked maleimide and polymaleimide compounds

Imide-extended liquid bismaleimide resin

Thermosetting polyether oligomers, compositions and methods for use thereof

Free-radical curable polyesters and methods for use thereof

Free-radical curable polyesters and methods for use thereof

Monomers derived from pentacyclopentadecane dimethanol

DEXTER CORP

Hydrophobic vinyl monomers, formulations containing same, and uses therefor

Thermosetting resin compositions containing maleimide and/or vinyl compounds

Method for the preparation of maleimides

Epoxy-containing die-attach compositions

Maleimide containing formulations and uses therefor

Low viscosity acrylate monomers formulations containing same and uses therefor

Method for isomerization of arylpropargyl ether monomers and uses therefor

DERSHEM STEPHEN M

Curatives for epoxy compositions

Amide-extended crosslinking compounds and methods for use thereof

Functionalized styrene oligomers and polymers

Low temperature curing acrylate and maleimide based formulations and methods for use thereof

LOCTITE

Heterobifunctional monomers and uses therefor

Hydrophobic, high Tg cycloaliphatic epoxy resins

QUANTUM MATERIALS DEXTER CORP

Bismaleimide-divinyl adhesive compositions and uses therefor

HENKEL LOCTITE CORP

Radical polymerizable compositions containing polycyclic olefins

LOCTITE CORP

Low shrinkage thermosetting resin compositions and methods of use thereof