Inventor
DOGIAMIS GEORGIOS
US75 patents
Patents
50 patentsUS10951248B1Mar 16, 2021
Radio frequency (RF) module with shared inductor
INTEL CORP9 citations86
US11476554B2Oct 18, 2022
Mmwave waveguide to waveguide connectors for automotive applications
INTEL CORP9 citations84
US11984439B2May 14, 2024
Microelectronic assemblies
INTEL CORP2 citations73
US11830787B2Nov 28, 2023
Thermal management in integrated circuit packages
INTEL CORP2 citations73
US11784108B2Oct 10, 2023
Thermal management in integrated circuit packages
INTEL CORP2 citations73
US11716826B2Aug 1, 2023
Platforms including microelectronic packages therein coupled to a chassis, where waveguides couple the microelectronic packages to each other and usable in a computing device
INTEL CORP2 citations73
US11538758B2Dec 27, 2022
Waveguide interconnect bridges
INTEL CORP3 citations73
US11394094B2Jul 19, 2022
Waveguide connector having a curved array of waveguides configured to connect a package to excitation elements
INTEL CORP2 citations73
US11329359B2May 10, 2022
Dielectric waveguide including a dielectric material with cavities therein surrounded by a conductive coating forming a wall for the cavities
INTEL CORP2 citations73
US11316497B2Apr 26, 2022
Multi-filter die
INTEL CORP4 citations73
US11310907B2Apr 19, 2022
Microelectronic package with substrate-integrated components
INTEL CORP3 citations73
US11309619B2Apr 19, 2022
Waveguide coupling systems and methods
INTEL CORP2 citations73
US11264687B2Mar 1, 2022
Microelectronic assemblies comprising a package substrate portion integrated with a substrate integrated waveguide filter
INTEL CORP2 citations73
US11251512B2Feb 15, 2022
Pluggable MM-wave module for rack scale architecture (RSA) servers and high performance computers (HPCS)
INTEL CORP4 citations73
US11011470B1May 18, 2021
Microelectronic package with mold-integrated components
INTEL CORP2 citations73
US10992016B2Apr 27, 2021
Multiplexer and combiner structures embedded in a mmwave connector interface
INTEL CORP2 citations73
US12406962B2Sep 2, 2025
Power delivery through capacitor-dies in a multi-layered microelectronic assembly
INTEL CORP2 citations70
US12266840B2Apr 1, 2025
Waveguide interconnects for semiconductor packages and related methods
INTEL CORP1 citations64
US12463156B2Nov 4, 2025
Packaging architectures for sub-terahertz radio frequency devices
INTEL CORP0 citations63
US12341114B2Jun 24, 2025
Microelectronic assemblies having a hybrid bonded interposer for die-to-die fan-out scaling
INTEL CORP0 citations63
US12327795B2Jun 10, 2025
Waveguide interconnect bridges
INTEL CORP0 citations63
US12300579B2May 13, 2025
Liquid cooled interposer for integrated circuit stack
INTEL CORP0 citations63
US12261097B2Mar 25, 2025
Thermal management in integrated circuit packages
INTEL CORP0 citations63
US12155372B2Nov 26, 2024
Multi-filter die
INTEL CORP0 citations63
US12040776B2Jul 16, 2024
Integrated radio frequency (RF) front-end module (FEM)
INTEL CORP0 citations63
US12007170B2Jun 11, 2024
Thermal management in integrated circuit packages
INTEL CORP0 citations63
US11842826B2Dec 12, 2023
Additive manufacturing for integrated circuit assembly connector support structures
INTEL CORP0 citations63
US11764452B2Sep 19, 2023
Integrated circuit including a dielectric waveguide with a cavity therein surrounded by a conductive coating forming a wall for the cavity
INTEL CORP0 citations63
US11728290B2Aug 15, 2023
Waveguide fan-out
INTEL CORP1 citations63
US11715693B2Aug 1, 2023
Dielectric waveguide channel for interconnecting dies in a semiconductor package usable in a computing device and method of manufacture
INTEL CORP0 citations63
US11694962B2Jul 4, 2023
Microelectronic package with mold-integrated components
INTEL CORP0 citations63
US11688660B2Jun 27, 2023
Bridge for radio frequency (RF) multi-chip modules
INTEL CORP0 citations63
US11652264B2May 16, 2023
Microelectronic assemblies with substrate integrated waveguide
INTEL CORP0 citations63
US11641711B2May 2, 2023
Microelectronic package with substrate-integrated components
INTEL CORP0 citations63
US11621192B2Apr 4, 2023
Inorganic dies with organic interconnect layers and related structures
INTEL CORP0 citations63
US11605603B2Mar 14, 2023
Microelectronic package with radio frequency (RF) chiplet
INTEL CORP0 citations63
US11158917B2Oct 26, 2021
Dual-substrate waveguide filter
INTEL CORP0 citations63
US11062947B1Jul 13, 2021
Inorganic dies with organic interconnect layers and related structures
INTEL CORP0 citations63
US10998879B2May 4, 2021
Monolithic die with acoustic wave resonators and active circuitry
INTEL CORP0 citations63
US12199012B2Jan 14, 2025
Modular microchannel thermal solutions for integrated circuit devices
INTEL CORP0 citations62
US12170244B2Dec 17, 2024
High-throughput additively manufactured power delivery vias and traces
INTEL CORP0 citations62
US12150271B2Nov 19, 2024
Platforms including microelectronic packages therein coupled to a chassis, where waveguides couple the microelectronic packages to each other and usable in a computing device
INTEL CORP0 citations62
US12040307B2Jul 16, 2024
Magnetic induced heating for solder interconnects
INTEL CORP0 citations62
US11916604B2Feb 27, 2024
Dispersion compensation for electromagnetic waveguides
INTEL CORP0 citations62
US11895815B2Feb 6, 2024
Additive manufacturing for integrated circuit assembly cables
INTEL CORP0 citations62
US11887944B2Jan 30, 2024
Additive manufacturing for integrated circuit assembly connectors
INTEL CORP0 citations62
US11532574B2Dec 20, 2022
Through-substrate waveguide
INTEL CORP0 citations62
US11462810B2Oct 4, 2022
Multiplexer and combiner structures embedded in a mmwave connector interface
INTEL CORP0 citations62
US11437706B2Sep 6, 2022
Package with side-radiating wave launcher and waveguide
INTEL CORP1 citations62
US11367937B2Jun 21, 2022
Waveguides with active or passive repeaters for range extension
INTEL CORP0 citations62
Showing the top 50 of 75 patents by PatentIndex Score.