Inventor

KAMGAING TELESPHOR

US198 patents

⚠️ This page may combine multiple inventors who share the name “KAMGAING TELESPHOR”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

KAMGAING TELESPHOR

INTEL CORP

Single-package phased array module with interleaved sub-arrays

Compact integration of LC resonators

Die package with superposer substrate for passive components

Multi-layer package with integrated antenna

Channelization for dispersion limited waveguide communication channels

Multiband antenna array using electromagnetic bandgap structures

Package embedded three dimensional balun

Radio frequency (RF) module with shared inductor

Microelectronic devices designed with flexible package substrates with distributed stacked antennas for high frequency communication systems

Embedded millimeter-wave phased array module

Mmwave waveguide to waveguide connectors for automotive applications

Hybrid filter architecture with integrated passives, acoustic wave resonators and hermetically sealed cavities between two resonator dies

Microelectronic devices designed with mold patterning to create package-level components for high frequency communication systems

Semiconductor packages with antennas

Microelectronic devices with high frequency communication modules having compound semiconductor devices integrated on a package fabric

Microelectronic devices designed with high frequency communication devices including compound semiconductor devices integrated on a die fabric on package

Microelectronic package communication using radio interfaces connected through waveguides

Microelectronic devices designed with high frequency communication modules having steerable beamforming capability

Waveguide communication with increased link data rate

Through-silicon via (TSV)-based devices and associated techniques and configurations

Embedded millimeter-wave phased array module

Distributed on-package millimeter-wave radio

Series and parallel hybrid switched capacitor networks for IC power delivery

Package structures including discrete antennas assembled on a device

Integrated voltage regulators with magnetically enhanced inductors

Bandpass filter having first and second serially coupled collection of filter components for providing upper and lower rejection notches

Thermal management in integrated circuit packages

Thermal management in integrated circuit packages

Platforms including microelectronic packages therein coupled to a chassis, where waveguides couple the microelectronic packages to each other and usable in a computing device

Semiconductor packages with antennas

RF front end module including hybrid filter and active circuits in a single package

Microelectronic devices designed with 3D stacked ultra thin package modules for high frequency communications

Waveguide connector having a curved array of waveguides configured to connect a package to excitation elements

Microelectronic devices with high frequency communication modules having compound semiconductor devices integrated on a package fabric

Microelectronic devices designed with compound semiconductor devices and integrated on an inter die fabric

Dielectric waveguide including a dielectric material with cavities therein surrounded by a conductive coating forming a wall for the cavities

Multi-filter die

Microelectronic package with substrate-integrated components

Waveguide coupling systems and methods

Pluggable MM-wave module for rack scale architecture (RSA) servers and high performance computers (HPCS)

In-package RF waveguides as high bandwidth chip-to-chip interconnects and methods for using the same

KAMGAING TELESPHOR

Radio- and electromagnetic interference through-silicon vias for stacked-die packages, and methods of making same

High performance glass-based 60 ghz / mm-wave phased array antennas and methods of making same

Chip packages including through-silicon via dice with vertically inegrated phased-array antennas and low-frequency and power delivery substrates

ORAW BRADLEY S

Integration of switched capacitor networks for power delivery

Series and parallel hybrid switched capacitor networks for IC power delivery

ORAW BRADLEY

Drive and startup for a switched capacitor divider

SARASWAT RUCHIR

Fully integrated voltage regulators for multi-stack integrated circuit architectures

SHIN JAEMIN

Package embedded equalizer

KONG CHUNG PENG JACKSON

Hybrid package transmission line circuits