Inventor

KIM YOUNGJOON

KR46 patents

⚠️ This page may combine multiple inventors who share the name “KIM YOUNGJOON”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

KIM YOUNGJOON

SAMSUNG ELECTRONICS CO LTD

Directional coupler and electronic device having the same

Methods and apparatuses for providing guide information for a camera

Method and device for self-interference cancellation in wireless communication system

Method and apparatus for sharing frequency resource dynamically in wireless communication system

Directional coupler and electronic device having the same

Method and apparatus for controlling power output from electronic device to external electronic device in a wireless communication system

Method and apparatus for random access using PRACH in multi-dimensional structure in wireless communication system

Method and apparatus for power control for network energy optimization

Printed circuit board and electronic device comprising coupler

Method, system, and apparatus for sharing dynamic frequency in mobile communication system

Method and apparatus for sharing frequency resources between mobile communication providers in wireless communication system

Electronic device having touch sensor

Method and apparatus for transmitting and receiving of adaptive polar coding configuration

PABLO AIR CO LTD

Method and apparatus for handling goods by a group of collaborating unmanned aerial vehicles

Method and apparatus for delivering goods by collaboration of autonomous vehicles

Method and apparatus for handling goods by unmanned aerial vehicle and autonomous vehicle

Method and apparatus for managing flight plan

Method and apparatus for handling goods by a group of collaborating unmanned aerial vehicles

Method and apparatus for handling goods by unmanned aerial vehicle and autonomous vehicle

Autonomous vehicle

Method for handling goods by collaboration of autonomous objects

Autonomous vehicle for handling goods in cooperation with unmanned aerial vehicle and method thereof

Method and apparatus for handling goods by unmanned aerial vehicle and autonomous vehicle

Autonomous vehicle for handling goods in cooperation with unmanned aerial vehicle and method thereof

Apparatus for assisting formation flight of unmanned aerial vehicle

LG ELECTRONICS INC

Mobile terminal and control method thereof

Mobile terminal and control method thereof

Mobile terminal and control method therefor

Beverage maker

Decompression mechanism and beverage maker having decompression mechanism

Beverage maker and method for controlling beverage maker

Mobile terminal and method of controlling the same

Mobile terminal and method of controlling same

KIM YOUNGJOON

Semiconductor device and method of forming stacked semiconductor die and conductive interconnect structure through an encapsulant

Mountable integrated circuit package system with intra-stack encapsulation

Integrated circuit packaging system using bottom flip chip die bonding and method of manufacture thereof

STATS CHIPPAC LTD

Package stacking system with mold contamination prevention

Semiconductor device and method of forming bump structure with insulating buffer layer to reduce stress on semiconductor wafer

Semiconductor device and method of forming stacked semiconductor die and conductive interconnect structure through an encapsulant

HYUNDAI MOTOR CO LTD

Hydraulic pressure supply system of automatic transmission for vehicle

Semiconductor device comprising accumulation layer channel and inversion layer channel

JANG KI YOUN

Integrated circuit packaging system with stacked lead and method of manufacture thereof

CHOI JOONYOUNG

Semiconductor device and method of forming bump structure with insulating buffer layer to reduce stress on semiconductor wafer

MAGNACHIP SEMICONDUCTOR LTD

Temperature sensor for display driver circuit and operating method thereof

KIM KYUNGOE

Methods for manufacturing thermally enhanced flip-chip ball grid arrays

KIM DAESUP

Integrated circuit packaging system with chip stacking and method of manufacture thereof