Inventor

ZINN ALFRED A

US54 patents

⚠️ This page may combine multiple inventors who share the name “ZINN ALFRED A”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

ZINN ALFRED A

KUPRION INC

Electronics assemblies employing copper in multiple locations

Thermal management in circuit board assemblies

Garments, gloves and personal protective equipment enchanced with metal nanoparticle agglomerates

Thermal management in circuit board assemblies

Electronics assemblies employing copper in multiple locations

Thermal management in circuit board assemblies

Thermal management in circuit board assemblies

Metal nanoparticles formed around a nucleus and scalable processes for producing same

Nanoparticle paste compositions and connections formed therefrom

Ink composition, method for forming a conductive member, and conductive device

Method of interconnecting nanowires, nanowire network and transparent conductive electrode

Ink composition, method for forming a conductive member, and conductive device

Articles coated with metal nanoparticle agglomerates

Antiseptic applications of metal nanoparticle agglomerates

Ceramic-based circuit board assemblies formed using metal nanoparticles

Copper nanoparticle application processes for low temperature printable, flexible/conformal electronics and antennas

Metal nanoparticles formed around a nucleus and scalable processes for producing same

Air filtration media having metal nanoparticle agglomerates adhered thereto, formation thereof and use thereof

Method of interconnecting nanowires and transparent conductive electrode

LOCKHEED CORP

Rhenium nanoparticles

AC-driven high electron mobility transistor devices

Metal nanoparticles formed around a nucleus and scalable processes for producing same

Nanoparticle composition and methods of making the same

Nanoparticle paste formulations and methods for production and use thereof

Articles containing copper nanoparticles and methods for production and use thereof

Wire bonding methods and systems incorporating metal nanoparticles

High-power electronic devices containing metal nanoparticle-based thermal interface materials and related methods

Nano-structured refractory metals, metal carbides, and coatings and parts fabricated therefrom

Nanoparticle application with adhesives for printable electronics

Articles having an exposed surface coating formed from copper nanoparticles

Nano-structured refractory metals, metal carbides, and coatings and parts fabricated therefrom

Scalable processes for forming tin nanoparticles, compositions containing tin nanoparticles, and applications utilizing same

Wire bonding methods and systems incorporating metal nanoparticles

Heat spreaders fabricated from metal nanoparticles

ZINN ALFRED A

Nanostructured metal-diamond composite thermal interface material (TIM) with improved thermal conductivity

Compositions containing tin nanoparticles and methods for use thereof

Lead solder-free electronics

Nanoparticle composition and methods of making the same

Stabilized metal nanoparticles and methods for production thereof

Copper nanoparticle application processes for low temperature printable, flexible/conformal electronics and antennas

Nanoporous coating synthesis and apparatus

Methods for rework of a solder

Nanoporous coating synthesis and apparatus

Metal nanoparticles and methods for producing and using same

EUROP AGENCE SPATIALE

Sub-millimeter wavelength camera

Tuneable phase shifter and/or attenuator using photoresponsive-material in a waveguide

BOEING CO

Hybrid aerogel rigid ceramic fiber insulation and method of producing same

GOLIGHTLY JUSTIN S

Tin nanoparticles and methodology for making same

BEDWORTH PETER V

Articles containing copper nanoparticles and methods for production and use thereof

UNIV NANYANG TECH

Conductive paste, method for forming an interconnection and electrical device