Inventor
NEMOUCHI FABRICE
FR36 patents
⚠️ This page may combine multiple inventors who share the name “NEMOUCHI FABRICE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
COMMISSARIAT ENERGIE ATOMIQUE
28 patentsUS7842612B2Nov 30, 2010
Selective formation of a compound comprising a semi-conducting material and a metallic material in a substrate through a germanium oxide layer
COMMISSARIAT ENERGIE ATOMIQUE8 citations83
US9269570B2Feb 23, 2016
Contact on a heterogeneous semiconductor substrate
COMMISSARIAT ENERGIE ATOMIQUE3 citations73
US11929290B2Mar 12, 2024
Method of manufacturing microelectronic components
COMMISSARIAT ENERGIE ATOMIQUE0 citations62
US11217446B2Jan 4, 2022
Method for fabricating an integrated circuit including a NMOS transistor and a PMOS transistor
COMMISSARIAT ENERGIE ATOMIQUE1 citations62
US10340361B2Jul 2, 2019
Forming of a MOS transistor based on a two-dimensional semiconductor material
COMMISSARIAT ENERGIE ATOMIQUE1 citations62
US11941485B2Mar 26, 2024
Method of making a quantum device
COMMISSARIAT ENERGIE ATOMIQUE0 citations61
US7972911B1Jul 5, 2011
Method for forming metallic materials comprising semi-conductors
COMMISSARIAT ENERGIE ATOMIQUE2 citations57
US12408405B2Sep 2, 2025
Device comprising spacers including a localised airgap and associated manufacturing methods
COMMISSARIAT ENERGIE ATOMIQUE0 citations52
US11387147B2Jul 12, 2022
Method for producing a component by filling a cavity within an electrical isolation area with carbon-based material
COMMISSARIAT ENERGIE ATOMIQUE0 citations52
US10930562B2Feb 23, 2021
Internal via with improved contact for upper semi-conductor layer of a 3D circuit
COMMISSARIAT ENERGIE ATOMIQUE0 citations52
US12550404B2Feb 10, 2026
Semiconductor device and associated manufacturing method
COMMISSARIAT ENERGIE ATOMIQUE0 citations51
US11515148B2Nov 29, 2022
Method for producing at least one device in compressive strained semiconductor
COMMISSARIAT ENERGIE ATOMIQUE0 citations51
US11362181B2Jun 14, 2022
Method for manufacturing an electronic component having multiple quantum dots
COMMISSARIAT ENERGIE ATOMIQUE0 citations51
US9548210B2Jan 17, 2017
Fabrication method of a transistor with improved field effect
COMMISSARIAT ENERGIE ATOMIQUE1 citations51
US12477785B2Nov 18, 2025
Quantum device and method for producing the same
COMMISSARIAT ENERGIE ATOMIQUE0 citations50
US9911827B2Mar 6, 2018
SBFET transistor and corresponding fabrication process
COMMISSARIAT ENERGIE ATOMIQUE0 citations50
US9831319B2Nov 28, 2017
Transistor with MIS connections and fabricating process
COMMISSARIAT ENERGIE ATOMIQUE0 citations50
US12477958B2Nov 18, 2025
Method for making an electronic device with superconductor qubit(s) including at least one JoFET
COMMISSARIAT ENERGIE ATOMIQUE0 citations49
US12417919B2Sep 16, 2025
Method for producing a superconducting vanadium silicide on a silicon layer
COMMISSARIAT ENERGIE ATOMIQUE0 citations49
US11698488B2Jul 11, 2023
Method for fabricating a heterostructure comprising active or passive elementary structure made of III-V material on the surface of a silicon-based substrate
COMMISSARIAT ENERGIE ATOMIQUE0 citations47
US11075501B2Jul 27, 2021
Process for producing a component comprising III-V materials and contacts compatible with silicon process flows
COMMISSARIAT ENERGIE ATOMIQUE0 citations46
US9997395B2Jun 12, 2018
Fabrication method of a stack of electronic devices
COMMISSARIAT ENERGIE ATOMIQUE0 citations46
US10199276B2Feb 5, 2019
Semiconductor and metal alloy interconnections for a 3D circuit
COMMISSARIAT ENERGIE ATOMIQUE0 citations41
US12402542B2Aug 26, 2025
Josephson transistor
COMMISSARIAT ENERGIE ATOMIQUE0 citations39
US11631739B2Apr 18, 2023
Transistor having blocks of source and drain silicides near the channel
COMMISSARIAT ENERGIE ATOMIQUE0 citations38
US10388653B2Aug 20, 2019
Formation of Ohmic contacts for a device provided with a region made of III-V material and a region made of another semiconductor material
COMMISSARIAT ENERGIE ATOMIQUE0 citations35
US9379024B2Jun 28, 2016
Method for manufacturing a microelectronic device including depositing identical or different metallic layers on the same wafer
COMMISSARIAT ENERGIE ATOMIQUE0 citations34
US10361087B2Jul 23, 2019
Process for producing an intermetallic contact based on Ni on InxGa1-xAs
COMMISSARIAT ENERGIE ATOMIQUE0 citations33
NEMOUCHI FABRICE
3 patentsUS8664104B2Mar 4, 2014
Method of producing a device with transistors strained by means of an external layer
NEMOUCHI FABRICE4 citations68
US8586463B2Nov 19, 2013
Method for preparing a layer comprising nickel monosilicide NiSi on a substrate comprising silicon
NEMOUCHI FABRICE3 citations55
US9093552B2Jul 28, 2015
Manufacturing method for a device with transistors strained by silicidation of source and drain zones
NEMOUCHI FABRICE1 citations47