Inventor

NI CHYI-TSONG

TW60 patents

⚠️ This page may combine multiple inventors who share the name “NI CHYI-TSONG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

NI CHYI-TSONG

TAIWAN SEMICONDUCTOR MFG CO LTD

Semiconductor structures having a micro-battery and methods for making the same

Fluorine-free interface for semiconductor device performance gain

Method and apparatus for a seal ring structure

Target measurement device and method for measuring a target

Deep trench capacitor with scallop profile

Semiconductor devices and methods of manufacturing thereof

Method and apparatus for semiconductor wafer

Semiconductor processing tool

SACVD system and method for reducing obstructions therein

Heterogenous bonding layers for direct semiconductor bonding

Heterogenous bonding layers for direct semiconductor bonding

Atomic layer deposition bonding layer for joining two semiconductor devices

Semiconductor processing tool

Apparatus and method for physical vapor deposition

Method and apparatus for semiconductor wafer cleaning

Semiconductor processing tool

Interface tool

Semiconductor structures having a micro-battery and methods for making the same

Semiconductor structures having a micro-battery and methods for making the same

Semiconductor structure and fabricating process for the same

Systems and methods for humidity control of FOUP during semiconductor fabrication

Deflector for chamber cleaning

Apparatus and method of manufacturing interconnect structures

Systems and methods for humidity control of FOUP during semiconductor fabrication

Semiconductor arrangement and method of making

Fluorine-free interface for semiconductor device performance gain

Fluorine-free interface for semiconductor device performance gain

Semiconductor fabrication apparatus

Semiconductor arrangement and method of making

Semiconductor fabrication apparatus

Reflector and/or method for ultraviolet curing of semiconductor

Reflector and/or method for ultraviolet curing of semiconductor

Target measurement device and method for measuring a target

Wafer bonding method and wafer bonding apparatus

Immersion cooling fin assembly and immersion cooling system for two-phase immersion cooling

Structure formation in a semiconductor device

Semiconductor processing tool and methods of operation

Methods of fabricating micro electro mechanical system structures

TAIWAN SEMICONDUCTOR MFG

Method of forming a storage node contact hole in a porous insulator layer

Solution for FSG induced metal corrosion &amp; metal peeling defects with extra bias liner and smooth RF bias ramp up

Low temperature method for minimizing copper hillock defects

Method of smoothening dielectric layer

High crack resistance nitride process

Method to produce porous oxide including forming a precoating oxide and a thermal oxide

Semiconductor structures having a micro-battery and methods for making the same

MOSEL VITELIC INC

Method of fabricating A1N anti-reflection coating on metal layer

Method for reducing the reflectivity of a silicide layer

CHIEN TING-YING

Micro electro mechanical system structures

SHIH YUN-TAI

Bonding alignment tool and method

CHIU YI HSUN

Method of fabrication of a semiconductor apparatus comprising substrates including Al/Ge and Cu contact layers to form a metallic alloy

Solution for FSG induced metal corrosion & metal peeling defects with extra bias liner and smooth RF bias ramp up