Inventor
WANG I-SHI
TW32 patents
⚠️ This page may combine multiple inventors who share the name “WANG I-SHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
28 patentsUS10361449B2Jul 23, 2019
Semiconductor structures having a micro-battery and methods for making the same
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US11192775B2Dec 7, 2021
Rough layer for better anti-stiction deposition
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US11174156B2Nov 16, 2021
Bonding process for forming semiconductor device structure
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US10173886B2Jan 8, 2019
Rough anti-stiction layer for MEMS device
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations71
US9884755B2Feb 6, 2018
Rough anti-stiction layer for MEMS device
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations71
US9725312B1Aug 8, 2017
Preconditioning to enhance hydrophilic fusion bonding
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations68
US11695150B2Jul 4, 2023
Semiconductor structures having a micro-battery and methods for making the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11101491B2Aug 24, 2021
Semiconductor structures having a micro-battery and methods for making the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US9444398B2Sep 13, 2016
Semiconductor structure and fabricating process for the same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations62
US12518980B2Jan 6, 2026
Semiconductor substrate bonding tool and methods of operation
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12258265B2Mar 25, 2025
Bonding process for forming semiconductor device structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11862482B2Jan 2, 2024
Semiconductor substrate bonding tool and methods of operation
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11772963B2Oct 3, 2023
Bonding process for forming semiconductor device structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11192778B2Dec 7, 2021
MEMS package with roughend interface
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US10273141B2Apr 30, 2019
Rough layer for better anti-stiction deposition
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations61
US12466727B2Nov 11, 2025
Extended acid etch for oxide removal
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations58
US11721662B2Aug 8, 2023
Wafer bonding method and wafer bonding apparatus
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations58
US11655146B2May 23, 2023
Extended acid etch for oxide removal
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations58
US12243848B2Mar 4, 2025
Methods and systems for improving fusion bonding
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations55
US11211354B2Dec 28, 2021
Systems and methods for semi-flexible eutectic bonder piece arranegments
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US10626010B2Apr 21, 2020
Bonding process for forming semiconductor device structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US10112826B2Oct 30, 2018
Method for forming micro-electro-mechanical system (MEMS) device structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US10759654B2Sep 1, 2020
Rough anti-stiction layer for MEMS device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations50
US10710872B2Jul 14, 2020
MEMS package with roughend interface
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations50
US9481567B2Nov 1, 2016
MEMS structure, cap substrate and method of fabricating the same
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations50
US9230918B1Jan 5, 2016
Semiconductor package structure, alignment structure, and alignment method
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations50
US10847490B2Nov 24, 2020
Bonding alignment tool
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations48
US10396054B2Aug 27, 2019
Bonding alignment tool
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations48