Inventor
SU CHING-HOU
TW22 patents
⚠️ This page may combine multiple inventors who share the name “SU CHING-HOU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
16 patentsUS10361449B2Jul 23, 2019
Semiconductor structures having a micro-battery and methods for making the same
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US11688633B2Jun 27, 2023
Passivation layer for integrated circuit structure and forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations71
US9650243B2May 16, 2017
Method and apparatus for a seal ring structure
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations71
US11488814B2Nov 1, 2022
Permeance magnetic assembly
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations69
US11695150B2Jul 4, 2023
Semiconductor structures having a micro-battery and methods for making the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11101491B2Aug 24, 2021
Semiconductor structures having a micro-battery and methods for making the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US9444398B2Sep 13, 2016
Semiconductor structure and fabricating process for the same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations62
US12125746B2Oct 22, 2024
Passivation layer for integrated circuit structure and forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US11069562B1Jul 20, 2021
Passivation layer for integrated circuit structure and forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US12198910B2Jan 14, 2025
Permeance magnetic assembly
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations59
US11854776B2Dec 26, 2023
Permeance magnetic assembly
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations59
US11721662B2Aug 8, 2023
Wafer bonding method and wafer bonding apparatus
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations58
US11211301B2Dec 28, 2021
Semiconductor device and method of manufacture
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations54
US9776857B2Oct 3, 2017
Methods of fabricating micro electro mechanical system structures
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US10847490B2Nov 24, 2020
Bonding alignment tool
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations48
US10396054B2Aug 27, 2019
Bonding alignment tool
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations48