Inventor
JEONG HYEON JO
KR3 patents
Patents
3 patentsUS5744827AApr 28, 1998
Three dimensional stack package device having exposed coupling lead portions and vertical interconnection elements
SAMSUNG ELECTRONICS CO LTD312 citations97
US5808354ASep 15, 1998
Lead frame for a semiconductor device comprising inner leads having a locking means for preventing the movement of molding compound against the inner lead surface
SAMSUNG ELECTRONICS CO LTD31 citations89
US5811875ASep 22, 1998
Lead frames including extended tie-bars, and semiconductor chip packages using same
SAMSUNG ELECTRONICS CO LTD11 citations71