Inventor
GOO JUNG-SUK
US34 patents
⚠️ This page may combine multiple inventors who share the name “GOO JUNG-SUK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ADVANCED MICRO DEVICES INC
22 patentsUS6800910B2Oct 5, 2004
FinFET device incorporating strained silicon in the channel region
ADVANCED MICRO DEVICES INC295 citations99
US7138302B2Nov 21, 2006
Method of fabricating an integrated circuit channel region
ADVANCED MICRO DEVICES INC70 citations98
US7078299B2Jul 18, 2006
Formation of finFET using a sidewall epitaxial layer
ADVANCED MICRO DEVICES INC118 citations98
US6902991B2Jun 7, 2005
Semiconductor device having a thick strained silicon layer and method of its formation
ADVANCED MICRO DEVICES INC76 citations98
US6955969B2Oct 18, 2005
Method of growing as a channel region to reduce source/drain junction capacitance
ADVANCED MICRO DEVICES INC89 citations97
US6943087B1Sep 13, 2005
Semiconductor on insulator MOSFET having strained silicon channel
ADVANCED MICRO DEVICES INC59 citations96
US6929992B1Aug 16, 2005
Strained silicon MOSFETs having NMOS gates with work functions for compensating NMOS threshold voltage shift
ADVANCED MICRO DEVICES INC78 citations96
US7170084B1Jan 30, 2007
Strained silicon MOSFET having improved source/drain extension dopant diffusion resistance and method for its fabrication
ADVANCED MICRO DEVICES INC21 citations93
US7015078B1Mar 21, 2006
Silicon on insulator substrate having improved thermal conductivity and method of its formation
ADVANCED MICRO DEVICES INC28 citations93
US6730576B1May 4, 2004
Method of forming a thick strained silicon layer and semiconductor structures incorporating a thick strained silicon layer
ADVANCED MICRO DEVICES INC28 citations93
US7033869B1Apr 25, 2006
Strained silicon semiconductor on insulator MOSFET
ADVANCED MICRO DEVICES INC48 citations92
US6936516B1Aug 30, 2005
Replacement gate strained silicon finFET process
ADVANCED MICRO DEVICES INC38 citations92
US7176531B1Feb 13, 2007
CMOS gates formed by integrating metals having different work functions and having a high-k gate dielectric
ADVANCED MICRO DEVICES INC22 citations91
US6872613B1Mar 29, 2005
Method for integrating metals having different work functions to form CMOS gates having a high-k gate dielectric and related structure
ADVANCED MICRO DEVICES INC28 citations91
US7012007B1Mar 14, 2006
Strained silicon MOSFET having improved thermal conductivity and method for its fabrication
ADVANCED MICRO DEVICES INC16 citations84
US6900143B1May 31, 2005
Strained silicon MOSFETs having improved thermal dissipation
ADVANCED MICRO DEVICES INC18 citations84
US6756276B1Jun 29, 2004
Strained silicon MOSFET having improved source/drain extension dopant diffusion resistance and method for its fabrication
ADVANCED MICRO DEVICES INC13 citations84
US7462549B2Dec 9, 2008
Shallow trench isolation process and structure with minimized strained silicon consumption
ADVANCED MICRO DEVICES INC5 citations74
US6962857B1Nov 8, 2005
Shallow trench isolation process using oxide deposition and anneal
ADVANCED MICRO DEVICES INC10 citations74
US6858503B1Feb 22, 2005
Depletion to avoid cross contamination
ADVANCED MICRO DEVICES INC10 citations74
US7761823B2Jul 20, 2010
Method for adjusting a transistor model for increased circuit simulation accuracy
ADVANCED MICRO DEVICES INC2 citations63
US7977172B2Jul 12, 2011
Dynamic random access memory (DRAM) cells and methods for fabricating the same
ADVANCED MICRO DEVICES INC5 citations62
GLOBALFOUNDRIES INC
4 patentsUS7880229B2Feb 1, 2011
Body tie test structure for accurate body effect measurement
GLOBALFOUNDRIES INC2 citations62
US7932103B2Apr 26, 2011
Integrated circuit system with MOS device
GLOBALFOUNDRIES INC2 citations59
US7732336B2Jun 8, 2010
Shallow trench isolation process and structure with minimized strained silicon consumption
GLOBALFOUNDRIES INC0 citations52
US7923785B2Apr 12, 2011
Field effect transistor having increased carrier mobility
GLOBALFOUNDRIES INC0 citations42