Inventor
Kong Jieying
US9 patents
⚠️ This page may combine multiple inventors who share the name “Kong Jieying”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
8 patentsUS12191240B2Jan 7, 2025
Hybrid glass core for wafer level and panel level packaging applications
INTEL CORP0 citations61
US12125777B2Oct 22, 2024
Minimizing package impedance discontinuity through dielectric structure optimizations
INTEL CORP0 citations60
US11574862B2Feb 7, 2023
Optimal signal routing performance through dielectric material configuration designs in package substrate
INTEL CORP0 citations60
US11780210B2Oct 10, 2023
Glass dielectric layer with patterning
INTEL CORP1 citations58
US12442979B2Oct 14, 2025
Optical waveguide formed within in a glass layer
INTEL CORP1 citations57
US12557628B2Feb 17, 2026
Organic film stress buffer for interface of metal and dielectric
INTEL CORP0 citations54
US11348865B2May 31, 2022
Electronic device including a substrate having interconnects
INTEL CORP0 citations49
US12033930B2Jul 9, 2024
Selectively roughened copper architectures for low insertion loss conductive features
INTEL CORP0 citations47