Inventor
KANG TECK-GYU
US45 patents
⚠️ This page may combine multiple inventors who share the name “KANG TECK-GYU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TESSERA INC
25 patentsUS7709968B2May 4, 2010
Micro pin grid array with pin motion isolation
TESSERA INC65 citations98
US7495179B2Feb 24, 2009
Components with posts and pads
TESSERA INC70 citations98
US7453157B2Nov 18, 2008
Microelectronic packages and methods therefor
TESSERA INC101 citations98
US7246431B2Jul 24, 2007
Methods of making microelectronic packages including folded substrates
TESSERA INC101 citations98
US7176506B2Feb 13, 2007
High frequency chip packages with connecting elements
TESSERA INC320 citations98
US7071547B2Jul 4, 2006
Assemblies having stacked semiconductor chips and methods of making same
TESSERA INC121 citations98
US7053485B2May 30, 2006
Microelectronic packages with self-aligning features
TESSERA INC76 citations98
US9224717B2Dec 29, 2015
Package-on-package assembly with wire bonds to encapsulation surface
TESSERA INC76 citations97
US9093435B2Jul 28, 2015
Package-on-package assembly with wire bonds to encapsulation surface
TESSERA INC68 citations97
US7268426B2Sep 11, 2007
High-frequency chip packages
TESSERA INC56 citations96
US7659617B2Feb 9, 2010
Substrate for a flexible microelectronic assembly and a method of fabricating thereof
TESSERA INC49 citations94
US7397068B2Jul 8, 2008
Solid state lighting device
TESSERA INC37 citations93
US7745943B2Jun 29, 2010
Microelectonic packages and methods therefor
TESSERA INC32 citations92
US7368695B2May 6, 2008
Image sensor package and fabrication method
TESSERA INC50 citations89
US10062661B2Aug 28, 2018
Package-on-package assembly with wire bonds to encapsulation surface
TESSERA INC5 citations84
US8046912B2Nov 1, 2011
Method of making a connection component with posts and pads
TESSERA INC5 citations74
US10593643B2Mar 17, 2020
Package-on-package assembly with wire bonds to encapsulation surface
TESSERA INC1 citations73
US7999397B2Aug 16, 2011
Microelectronic packages and methods therefor
TESSERA INC5 citations73
US9218988B2Dec 22, 2015
Microelectronic packages and methods therefor
TESSERA INC3 citations63
US7304376B2Dec 4, 2007
Microelectronic assemblies with springs
TESSERA INC4 citations63
US9691731B2Jun 27, 2017
Package-on-package assembly with wire bonds to encapsulation surface
TESSERA INC1 citations62
US10833044B2Nov 10, 2020
Package-on-package assembly with wire bonds to encapsulation surface
TESSERA INC0 citations52
US9984901B2May 29, 2018
Method for making a microelectronic assembly having conductive elements
TESSERA INC0 citations52
US9716075B2Jul 25, 2017
Semiconductor chip assembly and method for making same
TESSERA INC0 citations52
US8378487B2Feb 19, 2013
Wafer level chip package and a method of fabricating thereof
TESSERA INC0 citations52
HABA BELGACEM
5 patentsUS8728865B2May 20, 2014
Microelectronic packages and methods therefor
HABA BELGACEM88 citations99
US8093697B2Jan 10, 2012
Microelectronic packages and methods therefor
HABA BELGACEM117 citations99
US8058101B2Nov 15, 2011
Microelectronic packages and methods therefor
HABA BELGACEM87 citations99
US8329581B2Dec 11, 2012
Microelectronic packages and methods therefor
HABA BELGACEM45 citations97
US8641913B2Feb 4, 2014
Fine pitch microcontacts and method for forming thereof
HABA BELGACEM17 citations84
KANG TECK-GYU
5 patentsUS8415809B2Apr 9, 2013
Flip chip overmold package
KANG TECK-GYU16 citations92
US8125066B1Feb 28, 2012
Package on package configurations with embedded solder balls and interposal layer
KANG TECK-GYU31 citations92
US9137903B2Sep 15, 2015
Semiconductor chip assembly and method for making same
KANG TECK-GYU13 citations83
US8133808B2Mar 13, 2012
Wafer level chip package and a method of fabricating thereof
KANG TECK-GYU0 citations52
US8710643B2Apr 29, 2014
Electronic package with fluid flow barriers
KANG TECK-GYU1 citations51