Inventor
PARK DONGSAM
KR19 patents
⚠️ This page may combine multiple inventors who share the name “PARK DONGSAM”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
STATS CHIPPAC LTD
8 patentsUS7312519B2Dec 25, 2007
Stacked integrated circuit package-in-package system
STATS CHIPPAC LTD50 citations96
US7989950B2Aug 2, 2011
Integrated circuit packaging system having a cavity
STATS CHIPPAC LTD29 citations92
US7482203B2Jan 27, 2009
Stacked integrated circuit package-in-package system
STATS CHIPPAC LTD18 citations92
US7298037B2Nov 20, 2007
Stacked integrated circuit package-in-package system with recessed spacer
STATS CHIPPAC LTD27 citations92
US7986048B2Jul 26, 2011
Package-on-package system with through vias and method of manufacture thereof
STATS CHIPPAC LTD7 citations83
US7863100B2Jan 4, 2011
Integrated circuit packaging system with layered packaging and method of manufacture thereof
STATS CHIPPAC LTD3 citations60
US8008787B2Aug 30, 2011
Integrated circuit package system with delamination prevention structure
STATS CHIPPAC LTD2 citations59
US8367465B2Feb 5, 2013
Integrated circuit package on package system
STATS CHIPPAC LTD0 citations41
PARK DONGSAM
7 patentsUS8883561B2Nov 11, 2014
Semiconductor device and method of embedding TSV semiconductor die within encapsulant with TMV for vertical interconnect in POP
PARK DONGSAM71 citations96
US9087701B2Jul 21, 2015
Semiconductor device and method of embedding TSV semiconductor die within substrate for vertical interconnect in POP
PARK DONGSAM10 citations83
US8704365B2Apr 22, 2014
Integrated circuit packaging system having a cavity
PARK DONGSAM13 citations82
US8598034B2Dec 3, 2013
Package-on-package system with through vias and method of manufacture thereof
PARK DONGSAM4 citations61
US8110905B2Feb 7, 2012
Integrated circuit packaging system with leadframe interposer and method of manufacture thereof
PARK DONGSAM4 citations59
US8334601B2Dec 18, 2012
Package-on-package system with through vias and method of manufacture thereof
PARK DONGSAM2 citations58
US8460968B2Jun 11, 2013
Integrated circuit packaging system with post and method of manufacture thereof
PARK DONGSAM0 citations52
STATS CHIPPAC PTE LTD
3 patentsUS11823973B2Nov 21, 2023
Package with compartmentalized lid for heat spreader and EMI shield
STATS CHIPPAC PTE LTD2 citations73
US12107028B2Oct 1, 2024
Thermally enhanced FCBGA package
STATS CHIPPAC PTE LTD0 citations60
US11670563B2Jun 6, 2023
Thermally enhanced FCBGA package
STATS CHIPPAC PTE LTD0 citations60