Inventor

LIFF SHAWNA M

US160 patents

⚠️ This page may combine multiple inventors who share the name “LIFF SHAWNA M”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LIFF SHAWNA M

INTEL CORP

Integrated circuit package with embedded bridge

Microelectronic assemblies with communication networks

Quantum computing assemblies

Shielded interconnects

Direct bonding in microelectronic assemblies

Serializer-deserializer die for high speed signal interconnect

Quantum computing assemblies

Microelectronic assemblies having an integrated voltage regulator chiplet

Microelectronic assemblies

Microelectronic assemblies

Electrically functional fabric for flexible electronics

Microelectronic devices designed with high frequency communication devices including compound semiconductor devices integrated on a die fabric on package

Magnetic nanocomposite materials and passive components formed therewith

Integrated circuit package with embedded bridge

Optical I/O system using planar light-wave integrated circuit

Variable ball height on ball grid array packages by solder paste transfer

Integrated circuit package with embedded bridge

Picture frame stiffeners for microelectronic packages

Sacrificial redistribution layer in microelectronic assemblies having direct bonding

Ultra-thin, hyper-density semiconductor packages

Microelectronic structures having multiple microelectronic devices connected with a microelectronic bridge embedded in a microelectronic substrate

Stress isolation for silicon photonic applications

Ultra small molded module integrated with die by module-on-wafer assembly

Direct bonding in microelectronic assemblies

Microelectronic assemblies with inductors in direct bonding regions

Direct bonding in microelectronic assemblies

Stacked package with electrical connections created using high throughput additive manufacturing

Hermetic sealing structures in microelectronic assemblies having direct bonding

Microelectronic assemblies with communication networks

Microelectronic assemblies with inductors in direct bonding regions

Microelectronic assemblies

Microelectronic assemblies

Microelectronic assemblies with communication networks

Ultra small molded module integrated with die by module-on-wafer assembly

Microelectronic assemblies with communication networks

Microelectronic assemblies

Microelectronic assemblies

Microelectronic assemblies

Microelectronic assemblies

Microelectronic assemblies having magnetic core inductors

Microelectronic assemblies with communication networks

Microelectronic assemblies

Microelectronic assemblies with communication networks

Antenna package using ball attach array to connect antenna and base substrates

Microelectronic assemblies

Microelectronic assemblies

Microelectronic assemblies

Microelectronic assemblies

KOBRINSKY MAURO J

Optical I/O system using planar light-wave integrated circuit

NAIR VIJAY K

Method apparatus and material for radio frequency passives and antennas