Inventor

OSTER SASHA N

US84 patents

⚠️ This page may combine multiple inventors who share the name “OSTER SASHA N”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

OSTER SASHA N

INTEL CORP

Patch system for in-situ therapeutic treatment

Channelization for dispersion limited waveguide communication channels

Microelectronic devices designed with flexible package substrates with distributed stacked antennas for high frequency communication systems

Microelectronic devices designed with mold patterning to create package-level components for high frequency communication systems

Semiconductor packages with antennas

Microelectronic package communication using radio interfaces connected through waveguides

Waveguide communication with increased link data rate

Patch system for in-situ therapeutic treatment

Integration of pressure sensors into integrated circuit fabrication and packaging

Method and apparatus for an optical interconnect system

Methods of forming sensor integrated packages and structures formed thereby

Semiconductor packages with antennas

Microelectronic devices designed with 3D stacked ultra thin package modules for high frequency communications

Package integrated security features

Microelectronic devices designed with foldable flexible substrates for high frequency communication modules

Substrate dielectric waveguides in semiconductor packages

Adaptable displays using piezoelectric actuators

Microelectronic package communication using radio interfaces connected through wiring

Actuatable and adaptable metamaterials integrated in package

Waveguide connector with tapered slot launcher

Communication between integrated circuit packages using a millimeter-wave wireless radio fabric

Millimeter wave fabric network over dielectric waveguides

Plurality of dielectric waveguides including dielectric waveguide cores for connecting first and second server boards

Waveguide connector with slot launcher

Millimeter wave CMOS engines for waveguide fabrics

Magnetic detachable electrical connections between circuits

Piezoelectric package-integrated synthetic jet devices

Magnet placement for integrated sensor packages

Thermal management of molded packages

Microelectronic devices designed with mold patterning to create package-level components for high frequency communication systems

Semiconductor packages with antennas

Microelectronic devices designed with mold patterning to create package-level components for high frequency communication systems

Semiconductor packages with antennas

Microelectronic devices designed with mold patterning to create package-level components for high frequency communication systems

Microelectronic package communication using radio interfaces connected through wiring

Cross talk and interference reduction for high frequency wireless interconnects

Microelectronic devices designed with capacitive and enhanced inductive bumps

Assembly architecture employing organic support for compact and improved assembly throughput

Electronic devices with components formed by late binding using self-assembled monolayers

Methods for conductively coating millimeter waveguides

Inorganic piezoelectric materials formed on fibers and applications thereof

Methods for conductively coating millimeter waveguides

Waveguide comprising a dielectric waveguide core surrounded by a conductive layer, where the core includes multiple spaces void of dielectric

Waveguide comprising an extruded dielectric waveguide core that is coextruded with an outer conductive layer

Process for creating piezo-electric mirrors in package

Piezo actuators for optical beam steering applications

System comprising first and second servers interconnected by a plurality of joined waveguide sections

Piezoelectric package-integrated current sensing devices

LEE KYU OH

Integration of pressure or inertial sensors into integrated circuit fabrication and packaging

ROCKWELL COLLINS INC

Cup antenna radio