Inventor
RAO VALLURI R
US58 patents
⚠️ This page may combine multiple inventors who share the name “RAO VALLURI R”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
43 patentsUS6448168B1Sep 10, 2002
Method for distributing a clock on the silicon backside of an integrated circuit
INTEL CORP382 citations99
US6222246B1Apr 24, 2001
Flip-chip having an on-chip decoupling capacitor
INTEL CORP106 citations98
US5872360AFeb 16, 1999
Method and apparatus using an infrared laser based optical probe for measuring electric fields directly from active regions in an integrated circuit
INTEL CORP118 citations98
US6848177B2Feb 1, 2005
Integrated circuit die and an electronic assembly having a three-dimensional interconnection scheme
INTEL CORP86 citations97
US6037822AMar 14, 2000
Method and apparatus for distributing a clock on the silicon backside of an integrated circuit
INTEL CORP71 citations96
US11222863B2Jan 11, 2022
Techniques for die stacking and associated configurations
INTEL CORP21 citations94
US10615133B2Apr 7, 2020
Die package with superposer substrate for passive components
INTEL CORP22 citations94
US6570468B2May 27, 2003
Resonator frequency correction by modifying support structures
INTEL CORP35 citations93
US5952247ASep 14, 1999
Method of accessing the circuitry on a semiconductor substrate from the bottom of the semiconductor substrate
INTEL CORP34 citations93
US5805421ASep 8, 1998
Semiconductor substrate having alignment marks for locating circuitry on the substrate
INTEL CORP30 citations93
US10872820B2Dec 22, 2020
Integrated circuit structures
INTEL CORP22 citations92
US7339446B2Mar 4, 2008
Tunable resonator with MEMS element
INTEL CORP30 citations92
US7307331B2Dec 11, 2007
Integrated radio front-end module with embedded circuit elements
INTEL CORP26 citations92
US6316981B1Nov 13, 2001
Signal distribution network on backside of substrate
INTEL CORP23 citations92
US9166284B2Oct 20, 2015
Package structures including discrete antennas assembled on a device
INTEL CORP6 citations84
US7312505B2Dec 25, 2007
Semiconductor substrate with interconnections and embedded circuit elements
INTEL CORP11 citations84
US9686861B2Jun 20, 2017
Glass core substrate for integrated circuit devices and methods of making the same
INTEL CORP5 citations83
US7112887B2Sep 26, 2006
Integrated circuit die and an electronic assembly having a three-dimensional interconnection scheme
INTEL CORP15 citations83
US6122174ASep 19, 2000
Method of accessing the circuitry on a semiconductor substrate from the bottom of the semiconductor substrate
INTEL CORP6 citations74
US11016288B2May 25, 2021
Adaptable displays using piezoelectric actuators
INTEL CORP2 citations73
US10903818B2Jan 26, 2021
Piezoelectric package-integrated film bulk acoustic resonator devices
INTEL CORP3 citations73
US10594294B2Mar 17, 2020
Piezoelectric package-integrated delay lines
INTEL CORP2 citations73
US10453679B2Oct 22, 2019
Methods and devices integrating III-N transistor circuitry with Si transistor circuitry
INTEL CORP2 citations73
US10291283B2May 14, 2019
Tunable radio frequency systems using piezoelectric package-integrated switching devices
INTEL CORP6 citations73
US10134727B2Nov 20, 2018
High breakdown voltage III-N depletion mode MOS capacitors
INTEL CORP4 citations73
US9647636B1May 9, 2017
Piezoelectric package-integrated delay lines for radio frequency identification tags
INTEL CORP4 citations73
US10943836B2Mar 9, 2021
Gallium nitride NMOS on Si (111) co-integrated with a silicon PMOS
INTEL CORP0 citations63
US7302832B2Dec 4, 2007
Use of arrays of atomic force microscope/scanning tunneling microscope tips to scan nanocodes
INTEL CORP4 citations63
US11854894B2Dec 26, 2023
Integrated circuit device structures and double-sided electrical testing
INTEL CORP0 citations62
US11421376B2Aug 23, 2022
Inorganic piezoelectric materials formed on fibers and applications thereof
INTEL CORP0 citations62
US10969574B2Apr 6, 2021
Process for creating piezo-electric mirrors in package
INTEL CORP0 citations62
US10969576B2Apr 6, 2021
Piezo actuators for optical beam steering applications
INTEL CORP0 citations62
US10600787B2Mar 24, 2020
Silicon PMOS with gallium nitride NMOS for voltage regulation
INTEL CORP1 citations62
US10763248B2Sep 1, 2020
Multi-layer silicon/gallium nitride semiconductor
INTEL CORP1 citations61
US9881990B2Jan 30, 2018
Integrated inductor for integrated circuit devices
INTEL CORP1 citations60
US7782649B2Aug 24, 2010
Using controlled bias voltage for data retention enhancement in a ferroelectric media
INTEL CORP4 citations60
US10897238B2Jan 19, 2021
Piezoelectric package-integrated contour mode filter devices
INTEL CORP0 citations52
US10816733B2Oct 27, 2020
Piezoelectrically actuated mirrors for optical communications
INTEL CORP0 citations52
US10707136B2Jul 7, 2020
Gallium nitride NMOS on Si (111) co-integrated with a silicon PMOS
INTEL CORP0 citations52
US10658566B2May 19, 2020
Piezoelectric driven switches integrated in organic, flexible displays
INTEL CORP0 citations52
US10649158B2May 12, 2020
Alignment of single and multi-mode optical fibers using piezoelectric actuators
INTEL CORP0 citations52
US10432167B2Oct 1, 2019
Piezoelectric package-integrated crystal devices
INTEL CORP0 citations52
US10032052B2Jul 24, 2018
Piezoelectric package-integrated delay lines for radio frequency identification tags
INTEL CORP0 citations52
MA QING
3 patentsUS8207453B2Jun 26, 2012
Glass core substrate for integrated circuit devices and methods of making the same
MA QING28 citations92
US10070524B2Sep 4, 2018
Method of making glass core substrate for integrated circuit devices
MA QING2 citations72
US8068405B2Nov 29, 2011
Ferroelectric memory and method in which polarity of domain of ferroelectric memory is determined using ratio of currents
MA QING2 citations62
KAMGAING TELESPHOR
2 patentsUS8759950B2Jun 24, 2014
Radio- and electromagnetic interference through-silicon vias for stacked-die packages, and methods of making same
KAMGAING TELESPHOR22 citations92
US8816906B2Aug 26, 2014
Chip packages including through-silicon via dice with vertically inegrated phased-array antennas and low-frequency and power delivery substrates
KAMGAING TELESPHOR14 citations82
THEN HAN WUI
1 patentRAO VALLURI R
1 patentShowing the top 50 of 58 patents by PatentIndex Score.