Inventor

CHEN LUNG-HSIN

TW68 patents

⚠️ This page may combine multiple inventors who share the name “CHEN LUNG-HSIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHEN LUNG-HSIN

ADVANCED OPTOELECTRONIC TECH

LED light bar

Package structure for solid-state lighting devices and method of fabricating the same

LED package with reflecting cup

Light emitting diode package

Light-emitting diode with refracting lens

LED package with reflecting cup

Light emitting diode package

LED module

Flip chip light emitting diode packaging structure

Light emitting diode package with oxidation-resistant metal coating layer

Light emitting diode bulb

Method for manufacturing light emitting diode package having LED die fixed by anisotropic conductive paste

Optical lens, backlight module and display device using same

Light-emitting diode with reflecting lens

LED light bar

LED light bar

Lead frame and light emitting diode package having the same

LED package

Photoelectric device and method of manufacturing the same

LED package and LED die

LED package with reflecting cup

Photoelectric device and method of manufacturing the same

Photoelectric device

Flip-chip light emitting diode package with moisture barrier layer

LED lamp having a large illumination angle

Package structure of light-emitting diode

Light emitting diode package and method for manufacturing the same

Light-emitting element package and fabrication method thereof

Light emitting diode package and method for manufacturing the same

LED lamp structure

Light emitting diode package and manufacturing method thereof

LED light bar

Lead frame and light emitting diode package having the same

Lead frame and light emitting diode package having the same

Light emitting diode package and method for manufacturing same

Lens for light emitting device

CHEN LUNG-HSIN

Method for packaging light emitting diode

Method for manufacturing light emitting diode package

Light emitting diode package having fluorescent film directly coated on light emitting diode die and method for manufacturing the same

Method for manufacturing phosphor film and method for making LED package having the phosphor film

ADVANCED OPTOELECTRIC TECHNOLOGY INC

Package structure of photoelectronic device and fabricating method thereof

LED light bar

ZHONGSHAN INNOCLOUD IP SERVICES CO LTD

Light-emitting diode manufacturing method

Method for manufacturing light emitting diode packages

VIKING TECH CORP

Packaging method of thin film passive components on silicon chip

KUO CHESTER

Method for fabricating a flip-chip semiconductor optoelectronic device

LIN CHIH-YUNG

LED module

VIKING TECHNOLOGY CORP

Fabrication method for integrated passive component

ADVANCES OPTOELECTRONIC TECHNOLOGY INC

Package structure for solid-state lighting devices and method of fabricating the same

HSIEH MIN-TSUN

Light-emitting element package and fabrication method thereof